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Process Integration Engineer

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Hybrid

Process Integration Engineer

Lumicity

Process Integration Engineer

Skills

Testing & QAData Analysis

17 days ago

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Important information


Contract type:

Permanent

Salary:

$100,000 – $160,000 / year

Work mode:

Hybrid

Published on:

6 October 2026

What they need


Lumicity is partnering with a pioneering advanced packaging substrate manufacturer serving the high-performance computing market. They are hiring a Process Integration Engineer to lead substrate integration from customer requirements through qualification and mass production.

Please note: this is a fully onsite role in Covington, GA. Remote and hybrid work are not available.

The role

You will be the primary customer technical interface and the owner of cross-process "gray-zone" issues. That means aligning internal teams, finding root causes, and driving fast resolution.

What you'll do

-Lead substrate integration from customer requirements and design review through qualification, -ramp, and mass production

-Translate customer performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans

-Maintain end-to-end knowledge of substrate processes: material prep, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final QA

-Resolve technical gray zones between process modules where ownership, specs, or root causes are unclear

-Lead cross-process troubleshooting on yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues

-Coordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams on ownership, containment, root cause, corrective action, and closure

-Set process-interface criteria, monitor technical risks and KPIs, and report status to customers and management

-Apply SPC, DOE, FMEA, and structured problem-solving to improve capability, yield, and reliability

What you'll bring

-7+ years of engineering experience in semiconductor packaging, substrate manufacturing, process integration, product engineering, or technology development

-Strong understanding of advanced packaging and end-to-end glass or organic substrate manufacturing

-Experience leading customer-facing and cross-functional technical programs in a semiconductor manufacturing environment

-Proven ability to diagnose cross-process issues, clarify ownership, and lead root-cause resolution

-Ability to turn customer requirements into technical specs, process flows, and qualification plans

-Strong communication, data analysis, and executive-level stakeholder skills

-Bachelor's degree in Materials Science, Chemical, Mechanical, or Electrical Engineering, Chemistry, Physics, or a related field (master's preferred)

-Authorization to work in the United States

Nice to have

-Hands-on experience with technology qualification, NPI, manufacturing ramp, yield improvement, or high-volume production.

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