Lumicity
Process Integration Engineer
Skills
17 days ago
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Important information
Contract type:
Permanent
Salary:
$100,000 – $160,000 / year
Work mode:
Hybrid
Published on:
6 October 2026
What they need
Lumicity is partnering with a pioneering advanced packaging substrate manufacturer serving the high-performance computing market. They are hiring a Process Integration Engineer to lead substrate integration from customer requirements through qualification and mass production.
Please note: this is a fully onsite role in Covington, GA. Remote and hybrid work are not available.
The role
You will be the primary customer technical interface and the owner of cross-process "gray-zone" issues. That means aligning internal teams, finding root causes, and driving fast resolution.
What you'll do
-Lead substrate integration from customer requirements and design review through qualification, -ramp, and mass production
-Translate customer performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans
-Maintain end-to-end knowledge of substrate processes: material prep, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final QA
-Resolve technical gray zones between process modules where ownership, specs, or root causes are unclear
-Lead cross-process troubleshooting on yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues
-Coordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams on ownership, containment, root cause, corrective action, and closure
-Set process-interface criteria, monitor technical risks and KPIs, and report status to customers and management
-Apply SPC, DOE, FMEA, and structured problem-solving to improve capability, yield, and reliability
What you'll bring
-7+ years of engineering experience in semiconductor packaging, substrate manufacturing, process integration, product engineering, or technology development
-Strong understanding of advanced packaging and end-to-end glass or organic substrate manufacturing
-Experience leading customer-facing and cross-functional technical programs in a semiconductor manufacturing environment
-Proven ability to diagnose cross-process issues, clarify ownership, and lead root-cause resolution
-Ability to turn customer requirements into technical specs, process flows, and qualification plans
-Strong communication, data analysis, and executive-level stakeholder skills
-Bachelor's degree in Materials Science, Chemical, Mechanical, or Electrical Engineering, Chemistry, Physics, or a related field (master's preferred)
-Authorization to work in the United States
Nice to have
-Hands-on experience with technology qualification, NPI, manufacturing ramp, yield improvement, or high-volume production.
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