TSP Talent
Process Integration Engineer - DRAM
Skills
5 days ago
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Important information
Contract type:
Permanent
Location:
Boise, ID, USA
Work mode:
Onsite
Published on:
16 October 2026
What they need
We are seeking a BEOL Process Integration Expert with extensive experience in developing, transferring, and optimizing advanced DRAM technologies. Key Responsibilities Include
Defining and implementing BEOL process flows, build rules, and specifications for advanced DRAM products.
Leading troubleshooting and resolving complex integration issues across modules and fields.
Driving yield improvement and reliability initiatives through data-driven analysis.
Coordinating technology transfers for process qualification and high-volume ramp-up.
Engaging in industry benchmarking and collaborative projects to maintain technological leadership.
Pathfinding alternate architectures and enabling technologies.
Fostering innovation, continuous learning, and operational excellence within the team.
Qualifications
MS (required) or PhD in Electrical Engineering, Microelectronics, Materials Science, or related fields, with over 10 years of industry experience.
Expertise in metallization, barrier/liner engineering, dielectric integration, and reliability solutions for next-gen DRAM nodes.
Proven leadership in BEOL process development from R&D through pilot and manufacturing, including cross-node and site transfers.
Strong skills in statistical data analysis, problem-solving, leadership, communication, and project management.
Recognition for creativity, adaptability, and proactive approach to emerging challenges.
Patents and technical publications in DRAM BEOL integration are advantageous.
This role is ideal for ambitious individuals seeking to lead technological advancements and innovate within the semiconductor industry.
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