Process Integration Engineer (PIE)

• Support the integration, optimization, and control of wafer fabrication processes across multiple process

modules.

• Collaborate with Process Engineering, Equipment Engineering, Production, Yield, Quality, Reliability and

other cross-functional teams to improve product yield, quality and process stability.

• Design, execute and analyze engineering experiments to evaluate process interactions, identify

improvement opportunities and establish robust process conditions.

• Collect, interpret and correlate process, electrical, defect, metrology and yield data to identify trends,

abnormalities and key loss mechanisms.

• Lead or coordinate cross-module investigations for process excursions, yield loss and recurring technical

issues, and drive root cause analysis and corrective actions.

• Evaluate the impact of process, equipment, material or recipe changes on upstream and downstream

processes, product performance, reliability and yield.

• Support new product introduction, process qualification, technology transfer, engineering change and

production ramp-up activities.

• Coordinate process alignment and standardization activities across engineering teams and ensure effective implementation of approved improvements.

• Prepare technical reports, engineering documentation and presentations, and clearly communicate

technical issues, risks, results and recommendations to relevant stakeholders.

• Participate in continuous improvement projects related to yield, quality, productivity, cost and process

efficiency while maintaining compliance with cleanroom, quality and safety requirements.

Requirements

• Bachelor’s degree or above in Electrical/Electronic Engineering, Microelectronics, Materials Science,

Chemical Engineering, Physics, Mechanical Engineering or a related Engineering/Science discipline.

• Minimum 3 years of relevant experience in semiconductor wafer fabrication, process integration, process

engineering or a related technical function.

• Broad understanding of semiconductor wafer fabrication and the interaction between different process

modules; candidates should be comfortable working beyond a single specialty area.

• Exposure to multiple wafer-fab process areas such as Lithography, Etch, Thin Film/Deposition, Wet Process, Thermal/Furnace, Metrology, Implantation or Epitaxy is advantageous.

• Strong analytical, logical and critical-thinking skills, with the ability to interpret complex engineering and

manufacturing data.

• Experience with structured engineering methods such as DOE, SPC, FMEA, 8D, RCA or other statistical/problem-solving techniques.

• Strong communication and interpersonal skills, with the ability to coordinate effectively across engineering, production and management teams.

• Able to work independently, prioritize technical issues and drive actions to closure in a fast-paced

semiconductor environment.

• Good written and spoken English.

Preferred Qualifications

• Experience in high-volume semiconductor wafer-fab operations.

• Experience supporting new product introduction, technology transfer, process qualification or production.

• Familiarity with data-analysis tools such as JMP, Minitab, Python, SQL or equivalent platforms.

• Experience working with cross-site or global engineering teams is an advantage.

• Exposure to compound semiconductor, GaAs, III-V or specialty semiconductor technologies is an

advantage but not mandatory.