Process Integration Engineer（J15078）

Responsibilities:

1. Lead the full-process semiconductor chip process integration, identify key process bottlenecks, and optimize process parameters to improve product yield and stability.

2. Identify the root cause of defects through DOE experimental design, SPC Data Analysis, and Failure Analysis (FA), and drive XFN (PE/EE/QC) collaborative improvement.

3. Develop the mass production process window and ensure process stability.

4. Collaborate with the Equipment, Manufacturing, and Quality departments to establish standardized process flow (SOP/OI) and monitoring systems (FDC/APC).

5. Participate in the development of advanced technology nodes and explore new process integration solutions.

Qualifications:

1. Educational background: Master's degree or above, majoring in relevant fields such as microelectronics, materials science, physics, chemical engineering, etc.

2-3 years+ experience in semiconductor process integration, familiar with front-end (FEOL) or back-end (BEOL) process flows.

3. Familiar with the entire semiconductor manufacturing process (lithography/etching/thin film/CMP, etc.) and analysis of process interaction effects.

4. Master tools such as 8D/FMEA/SPC, and possess data modeling and statistical analysis capabilities.

5. Clear in logic, adept at systematically solving problems, and possessing innovative thinking.