IC Resources
Programme Director – Semiconductor Start-up
Skills
5 days ago
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Important information
Contract type:
Permanent
Location:
North Brabant, Netherlands
Work mode:
Onsite
Published on:
15 October 2026
What they need
A fast-growing deep-tech scale-up building a new AI compute platform from the ground up. Its proprietary processor architecture brings together custom silicon, stacked memory, advanced packaging, boards, firmware, system software and complete datacentre systems. This is a rare chance to lead delivery of next-generation AI hardware while the organisation, and the way it works, is still being shaped.
This is not a PMO or reporting role. You’ll be a hands-on semiconductor program leader who takes ownership of the integrated delivery of an AI compute platform, from product definition and architecture through tape-out, bring-up, package and system integration, software enablement, qualification and launch readiness.
What You’ll Own
- One integrated program baseline: scope, schedule, cost, resources, risks, decisions and external dependencies
- The silicon and tape-out critical path: RTL and verification readiness, design freeze, timing and power closure, sign-off evidence, mask release and foundry commitments
- System-in-Package (SiP) and advanced packaging delivery, integrated with silicon, boards, firmware and software
- Coordination of external partners, including physical design, foundry, memory, OSAT, packaging, test and IP vendors, holding owners to account at every interface
- Evidence-based readiness reviews with clear exit criteria, not status reporting
- Early identification of critical dependencies and recovery planning when things move off baseline
- Clear trade-offs and decisions for executive review, covering roadmap, investment, capacity and risk
- Building lean, practical Program Delivery ways of working as the business scales, and coaching program managers
What You’ll Bring
- Personal ownership of at least one successful silicon tape-out, ideally through bring-up, qualification and productisation
- Hands-on experience of SiP / advanced packaging programs
- A background in complex ASIC, AI accelerator, HPC, datacentre or similar deep-tech hardware programs
- Strong understanding of semiconductor dependencies: architecture, RTL, verification, physical design, IP, PDKs, foundry, packaging and test
- Experience managing external engineering, manufacturing and supply-chain partners
- Strong program controls: integrated planning, dependency and risk management, change control and gate reviews
- The confidence to influence without hierarchy and challenge plans constructively
- Comfort with ambiguity, limited process and fast-changing priorities in a scale-up
- A technical or engineering degree, or equivalent depth from industry experience
Working Pattern And Benefits
- Full-time and on-site in the Netherlands. Relocation to the Netherlands is required.
- 30 days’ holiday plus Dutch holiday allowance
- An attractive employee share option scheme (ESOP)
- Immediate or near-term start preferred
If you are interested in discussing the Programme Director role further, please contact Emily Wright @ IC Resources
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