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Programme Director – Semiconductor Start-up

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Onsite

Programme Director – Semiconductor Start-up

IC Resources

Programme Director – Semiconductor Start-up

Skills

AISupply ChainRisk Management

5 days ago

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Important information


Contract type:

Permanent

Location:

North Brabant, Netherlands

Work mode:

Onsite

Published on:

15 October 2026

What they need


A fast-growing deep-tech scale-up building a new AI compute platform from the ground up. Its proprietary processor architecture brings together custom silicon, stacked memory, advanced packaging, boards, firmware, system software and complete datacentre systems. This is a rare chance to lead delivery of next-generation AI hardware while the organisation, and the way it works, is still being shaped.

This is not a PMO or reporting role. You’ll be a hands-on semiconductor program leader who takes ownership of the integrated delivery of an AI compute platform, from product definition and architecture through tape-out, bring-up, package and system integration, software enablement, qualification and launch readiness.

What You’ll Own

  • One integrated program baseline: scope, schedule, cost, resources, risks, decisions and external dependencies
  • The silicon and tape-out critical path: RTL and verification readiness, design freeze, timing and power closure, sign-off evidence, mask release and foundry commitments
  • System-in-Package (SiP) and advanced packaging delivery, integrated with silicon, boards, firmware and software
  • Coordination of external partners, including physical design, foundry, memory, OSAT, packaging, test and IP vendors, holding owners to account at every interface
  • Evidence-based readiness reviews with clear exit criteria, not status reporting
  • Early identification of critical dependencies and recovery planning when things move off baseline
  • Clear trade-offs and decisions for executive review, covering roadmap, investment, capacity and risk
  • Building lean, practical Program Delivery ways of working as the business scales, and coaching program managers

What You’ll Bring

  • Personal ownership of at least one successful silicon tape-out, ideally through bring-up, qualification and productisation
  • Hands-on experience of SiP / advanced packaging programs
  • A background in complex ASIC, AI accelerator, HPC, datacentre or similar deep-tech hardware programs
  • Strong understanding of semiconductor dependencies: architecture, RTL, verification, physical design, IP, PDKs, foundry, packaging and test
  • Experience managing external engineering, manufacturing and supply-chain partners
  • Strong program controls: integrated planning, dependency and risk management, change control and gate reviews
  • The confidence to influence without hierarchy and challenge plans constructively
  • Comfort with ambiguity, limited process and fast-changing priorities in a scale-up
  • A technical or engineering degree, or equivalent depth from industry experience

Working Pattern And Benefits

  • Full-time and on-site in the Netherlands. Relocation to the Netherlands is required.
  • 30 days’ holiday plus Dutch holiday allowance
  • An attractive employee share option scheme (ESOP)
  • Immediate or near-term start preferred

If you are interested in discussing the Programme Director role further, please contact Emily Wright @ IC Resources

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