QFN封装研发工程师

该职位来源于猎聘 Job Purpose

• Power Semiconductor Package Development, product including discrete, QFN, Module products
• Technical Leadership on Power Technology Development and Enabling Technology
• Project Management of Automotive Power communicating with Automotive development Engineers and Process Development Engineers

Duties and Responsibilities

• Automotive Power Module Package and its related Enabling Technology development
• Responsible to conduct package development following Advanced Product Qualification Plan (APQP) Spec.
• Responsible for designed package’s internal, external outline, lead frame, process flow, reliability, cost structure with designer to meet new product or package development goals.
• Responsible to develop package to secure robust manufacturability, meet Quality requirements, Reliability, finance goal, product performance, Cost and Schedule.
• Responsible for development to meet design Rule and updated Design Rule and design rule updating.
• Study and understand customer requirements, application, EHS and design those things to package development.
• Generate and create development documents deliverables as FSC-QAR-0013 assigned to Package Engineering, such like design MFEA, control plan, process FMEA, look ahead reliability (LAR) plan, project charter, Quality function development, project schedule, line certification plan, to identify development cost, etc.
• To plan and execute process optimization, failure analysis, process characterization, samples build for package development.
• To find technical and systematic solution and scheduling for failures of reliability, quality, manufacturability, cost, and cycle time.
• Conduct DFM (Design for Manufacturing) review by holding technical and financial leadership for package development working with project member such like Industrial Engineering, Finance, SCM, Purchasing, Process Engineering, QA, Program management, Human resource, Facility, and manufacturing
• To share and update project progress, risk of delay, constraints, weekly at designated day to department manager
• Leadership and Communication
• To lead project team members to deliver package development goals.
• Track and remind team member for their tasks, deliverables, milestones of projects to be done in time with quality so that the project keep on schedule and completed in time successfully working with site Project Manager if assigned.
• Attend all project phase review and Project review in Manufacturing site for Automotive Power Module related Projects, and answer clearly technical inquiries.

Qualifications

• Experienced years: Longer than 8 years in Semiconductor Package Development, longer than 5years with master degree.
• Experienced areas: Semiconductor Package Development, Assembly Process Development, Preferred Project management certified or minimum two 2 years project management careers.
• Experienced jobs: Power Semiconductor Package and Process Development. Preferred Power Discrete and Power Module or Power IC. Preferred Project Management.
• Experienced packages: Semiconductor Packages, highly preferred Power discrete (like TO220, D-Pak, D2PAK) and Power module packages (like APM, SPM, IPM, IGBT/Diode module)
• Nationality: Chinese
• Education: Minimum 4yrs university graduated, Preferred master’s degree and above.
• Skills: Communication skills, written English and speaking with multi-cultural foreign engineers, JMP & Data analysis.
• Other characteristics such as personal characteristics: Self-motivated, independent, open mind to communicate, be willing to take risk and managing