超威半导体有限公司
R&D资深工艺开发工程师
Skills
2 months ago
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Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
4 September 2026
What they need
该职位来源于猎聘 工作职责： 1.负责新材料/技术/机器开发导入量产 2.在新产品导入阶段，与工艺工程师和供应商一起推动和改进良率。 3.熟悉并精通FCBGA、FCLGA后道制程的工艺流程 4.开发TCB制程,通过产品验证考核 5.NPI材料基础研究,提升产线良率 6.提出专利构想 7.其他上级交办任务 岗位要求： 1.五年以上半导体研发或制程经验 2.精通FCBGA和FCLGA等各种倒置封装工艺，具有相应产品的新项目导入和工艺团队管理经验。 3.优化现有工艺提升产品性能/良率改善 4.熟悉Wafer bumping,TSV，Fanout等晶圆级封装工艺，熟悉2.5D，3D等系统集成封装工艺。 5.具备项目管理, 以及和供货商/客户沟通能力 6.具备英文沟通能力
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