R&D Engineer

The ideal candidate will have expertise in advanced packaging technology, and ‘system in package’ assembly, including manufacturability and reliability issues with wide-ranging experience in semiconductor device fabrication and operation, test development and execution, reliability failure mechanisms and testing, assembly process development and qualification, and wafer foundry manufacturing operations. Can translate system-level performance requirements into modules and collaborate directly with external foundry R&D teams, OSATs to identify and/or jointly-develop candidate technologies.

Responsibilities include:

• Technical lead for multi chip semiconductor assembly and system pathfinding for leading-edge artificial intelligence and high-performance computing modules.
• Owns key portions of the advanced packaging and assembly, and system technology roadmap, and drives the development of new assembly technology from early R&D through new product introduction phases by close interaction with technical leads in system customer organizations and collaborating with internal IC design/validation teams and external foundry R&D groups.
• Defines technology requirements and roadmaps, evaluation and qualification plans, and provides hands-on applications support as technology transitions from process R&D to product development.
• Takes a leading role in advanced packaging technology problem solving, providing design and product enablement.
• Serves as the internal principal investigator for new technology projects.
• Capable of independent project management from concept phase through transfer to high-volume manufacturing, facilitating clear communication with external foundry & assembly collaborators, as well as internal design and validation teams throughout the project.
• Performs risk assessment and help to coordinate cross-functional technology risk mitigation for multiple projects in parallel.

Key Qualifications:

• Broad knowledge of advanced packaging, assembly and silicon process technologies, including thermal solutions, power delivery, and both electrical and optical communication
• Experience with design of both serial and parallel interfaces both for chip-to-chip communication within module and for external module communication
• Experience with parametric and yield data analysis. Proficiency with statistical data analysis tools
• Experience with yield failure mechanisms and tools for root cause finding (EFA, PFA)
• Experience with thermal and stress simulation tools
• Exceptional data analysis, problem solving, and interpersonal skills

Education & Experience:

• MSEE in Electrical Engineering or related field required and 15+ years of experience in semiconductor process technology, advanced packaging and manufacturing, specifically R&D and integration roles, or PhD and 12+ years of experience in semiconductor process technology and manufacturing, specifically R&D and integration roles

Additional Job Description: Compensation And Benefits The annual base salary range for this position is $167,500 - $268,000.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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