B
Broadcom
R&D Process Engineer
Skills
R
3 months ago
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Important information
Contract type:
Permanent
Work mode:
Onsite
Published on:
7 August 2026
What they need
- Responsible for the design and implementation of packaging processes for new isolation products.
- Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.
- Conduct Design of Experiments (DOE) and optimize newly developed processes.
- Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.
- Perform process yield analysis and failure investigations for new device-related issues.
- Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.
Requirement:
- We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.
- Strong background in Mechanical Engineering and semiconductor packaging process development.
- Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.
- Demonstrated analytical and critical thinking skills with strong problem-solving capabilities and a solution-oriented mindset.
- Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.
- Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.
- Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch is an advantage.
- Experience in Solidworks/ Ansys, CAD and simulation tools
R026160
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