R&D Singulation/Dicing Process Engineer

About the role

Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.

Key responsibilities

• Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies
• Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP
• Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness
• Provide technical support for customer programs, including feasibility evaluation and issue resolution
• Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness

About you

• Bachelor's degree in Engineering (Mechanical/Materials/Electronics)
• 3-5 years of hands-on experience in process engineering in semiconductor manufacturing
• Fundamental understanding of advanced semiconductor fabrication and integration processes
• Proficiency in preparing technical documentation and delivering presentations
• Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage