R&D/PRODUCT DVL ENGINEER II [DAC SI]

Job Overview

TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems.

Job Requirements

• Subject matter expert in signal integrity design, simulation and validation activities through product development cycles

• Establishing signal integrity design performance/functional requirements for new products

• Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.

• Performing PCB design schematic and layout reviews

• Creating actionable recommendations based upon design reviews and simulation results

• Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement

What your background should look like

• Bachelor’s degree in Electrical Engineering.

• Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax/RF cables, direct attach copper (DAC) cables)

• Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent)

• A solid understanding of electromagnetic theory and electrical circuit behavior

• Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.

• Familiarity with printed circuit board design, fabrication and assembly.

• Excellent verbal and written communication skills

• Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies

• Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English

• Individual must be highly motivated, a quick learner, and able to work independently

• Master’s degree a PLUS

• Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD)

• Test equipment (oscilloscope, vector network analyzer, BERT)

• Communication systems (high-speed servers, switches, routers, storage)

• Signal conditioning techniques (equalization, amplification)

• SixSigma methodologies or other strong data analytics background a PLUS.

• Experience in project leadership, especially as it applies across design, development & manufacturing teams

• Direct customer design and support experience

• Application and test knowledge of high-speed devices and equalization techniques

Competencies

Values: Integrity, Accountability, Inclusion, Innovation, Teamwork