Research And Development expert

Responsibilities:

Independently lead the entire NPI project for 2.5D CoWoS new products, from R&D trial to mass production ramp-up.

2. Evaluation and verification of new materials, new equipment, and new processes, as well as the formulation of DOE (temporary bonding adhesive, lithography, thin film, laser process, etc.).

3. Skilled in solving reliability issues such as wafer warpage, micro-bump false welding/bridge, RDL wire breakage, TSV void, thermal stress anomalies between different materials, and other related reliability issues that occur during the flow process and trial production.

4. Cross-departmental coordination: design, technology, equipment, quality, testing, substrate, customer liaison.

Qualifications:

1. Familiar with mainstream 2.5D packaging technology routes, such as CoWoS, EMIB, FOCoS, FCBGA.

2. Proficient in the complete process of CoWoS: silicon interposer, TSV, RDL, micro bump, FC mounting, temporary bonding, debonding, molding, backside process, and full-chain substrate assembly.

3. 2.5D and 3.0D packaging development experience.

4. Fluent in spoken English, familiar with Chinese.

5. 5 years or more of relevant R&D experience (Intel experience preferred).

6. Familiar with 2.5 and 3.0 process technologies.