Research Scientist (RP3)

Company Name:
Power Semiconductors and Applications Center (PowerSAC)

Job Title: Research Scientist (RP3)

Ref. No.: PowerSAC0009

PowerSAC is seeking a Research Scientist will serve as the technical lead for the integrated development of physics-informed and data-driven prediction methods, semiconductor and power-device characterization, and experimental test infrastructure.

Reporting to the Programme Lead, the appointee will define and execute the research plan, coordinate technical activities across modelling, testing and data workflows, and contribute to programme reporting, external collaboration, publications, intellectual property and technology transfer. The position requires hands-on technical contribution, coordination, and communication with the wider RP3 team.

Key Responsibilities

• Define and maintain the RP3 research agenda and technical roadmap, ensuring alignment with the objectives and deliverables of RP3 and InnoHK.
• Lead the development of physics-informed and data-driven methods for predicting the electrical, thermal, mechanical, reliability, and other relevant performance of power modules and systems
• Represent RP3 in all meetings with PowerSAC management team; prepare and present progress reports, milestone reviews, and budget justifications
• Provide high-level technical guidance and research direction to Engineers, Assistant Engineers, Technicians, and other research personnel
• Lead the publication and intellectual property strategy for RP3; oversee journal paper planning, review manuscripts, and identify patentable innovations
• Identify and develop technology transfer and industry engagement opportunities that build on RP3 research outputs

Requirements

• PhD in Electrical/Electronic Engineering, or closely related field
• At least 2 years of post-PhD research experience in power electronics or related fields, gained in a university, research institute or R&D environment.
• Expertise in semiconductor-device/power-device physics
• Hands-on experience in semiconductor fabrication processes
• Experience in power-device measurement and measurement-system development
• Working knowledge of AI/ML methods for engineering prediction
• Demonstrated publication record
• Experience in research collaboration, project reporting, intellectual property, or technology transfer is an advantage
• Proficiency in English and Chinese

Remuneration and Conditions of Service

Salary is highly competitive and will be commensurate with qualifications and experience. Fringe benefits including annual leave, medical and dental benefits will be provided.

Application Procedure

To apply, please send your application with a full curriculum vitae indicating the current and expected salaries to [email protected].

Review of applications will begin shortly and continue until the position is filled. We thank applicants for their interest but advise that only shortlisted candidates will be notified.

(Information provided by applicants will be used for recruitment and other employment-related purposes.)