Rework Technician

RESPONSIBILITES:

The Repair Technician performs controlled board-level repair, component rework, inspection, mechanical modification, and preparation for retest of legacy embedded-computer products.

The role also owns the operational BGA rework capability, including equipment readiness, process execution, records, and training of designated personnel.

The Repair Technician executes work using released procedures, documented engineering dispositions, and technical direction from the engineer responsible for the applicable product. The role is responsible for repeatable workmanship and complete traceability but does not independently determine engineering design changes, product dispositions, or diagnostic strategy.

Responsibilities include:

Board Repair and Rework

o Perform component removal, replacement, and board-level repair in accordance with approved procedures or written engineering instructions.

o Complete repairs identified through production testing, repair evaluation, or Guided Fault Isolation activities.

o Inspect boards for visible damage, workmanship defects, contamination, damaged traces, pads, vias, connectors, sockets, and other physical conditions.

o Perform jumper installation, connector replacement, socket replacement, and similar board-level rework within demonstrated qualifications.

o Clean and inspect repaired assemblies and prepare them for retest.

o Route repaired boards to the appropriate qualified test owner.

o Support retest activities when requested.

o Maintain traceability for removed and installed components.

o Record the work performed, components replaced, conditions observed, unexpected findings, and final repair status.

o Follow electrostatic-discharge, workmanship, safety, calibration, material-control, and quality requirements.

o Maintain assigned repair tools, soldering equipment, fixtures, consumables, and work areas.

o Stop work and escalate when instructions are unclear, unexpected damage is found, or required work exceeds the approved repair scope.

BGA Rework Capability Ownership

o Own the day-to-day operation and readiness of GDCA’s BGA rework capability.

o Maintain BGA rework equipment, tooling, fixtures, profiles, software configurations, consumables, and associated records.

o Verify that BGA equipment is serviceable, calibrated where applicable, and ready for use.

o Execute approved BGA removal, site preparation, component replacement, reballing, cleaning, inspection, and verification processes within demonstrated qualifications.

o Follow approved equipment settings, thermal profiles, process instructions, and acceptance criteria.

o Maintain controlled BGA equipment setup records and process-profile references.

o Preserve traceability for boards, BGA components, process settings, rework cycles, inspection results, and outcomes.

o Support Engineering and Quality in developing, validating, and improving BGA rework processes.

o Identify equipment, tooling, training, documentation, or process gaps that could affect BGA rework quality or repeatability.

o Coordinate preventive maintenance, calibration, repair, and replacement of BGA equipment and tooling.

o Monitor consumable condition and availability to maintain capability readiness.

QUALIFICATIONS:

▪ Technical certificate, associate degree, military electronics training, or equivalent hands-on electronics experience.

▪ Demonstrated experience with electronic assembly, soldering, component replacement, and printed-circuit-board repair, including through-hole and surface-mount components.

▪ Ability to read and follow schematics, assembly drawings, bills of material, repair instructions, engineering dispositions, and component markings.

▪ Experience using microscopes, soldering and desoldering systems, hot-air tools, preheaters, board-cleaning equipment, and related repair tooling.

▪ Demonstrated ability to follow controlled procedures, maintain accurate product and component traceability, and stop work when conditions exceed authorization.

▪ Experience with BGA removal, site preparation, replacement, reballing, thermal-profile execution, and post-rework inspection; formal BGA equipment training preferred.

▪ IPC J-STD-001, IPC-A-610, IPC-7711/7721, or equivalent certification preferred, particularly for high-reliability, industrial, aerospace, or defense electronics.