Section Manager Failure Analysis Quality Engineering

Remark: There is 2 open positions for Bayan Lepas & Batu Kawan

About the Role

TF AMD MICROELECTRONICS (PENANG) SDN. BHD. is seeking an experienced and dynamic Section Manager, Failure Analysis Quality Engineering to lead our Failure Analysis (FA) team in Penang, Malaysia.

In this role, you will be responsible for leading a team of engineers and specialists while overseeing failure analysis and quality engineering activities to support advanced semiconductor packaging technologies. You will drive technical excellence, root cause investigations, customer satisfaction, and continuous improvement initiatives to ensure the highest standards of quality, reliability, and operational performance.

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Key Responsibilities

Leadership & Team Management

• Lead, mentor, and develop a team of Failure Analysis (FA) engineers, technicians, and specialists.
• Establish clear goals, KPIs, and priorities aligned with business objectives and customer requirements.
• Manage manpower planning, workload distribution, and competency development programs.
• Foster a culture of technical excellence, accountability, collaboration, and continuous improvement.

Failure Analysis Operations

• Oversee end-to-end failure analysis activities, including customer returns (RMA), electrical failures, assembly and packaging defects, and reliability test failures.
• Ensure timely turnaround while maintaining high-quality analysis standards.
• Review, validate, and approve FA reports prior to release to customers and stakeholders.
• Establish and maintain standardized FA methodologies, workflows, and documentation practices.

Advanced Packaging Failure Analysis

• Lead failure investigations for advanced semiconductor packaging technologies, including Flip Chip (FC/FC-BGA), Wafer-Level Chip Scale Package (WLCSP), Fan-Out (FO), System-in-Package (SiP), BGA, and related technologies.
• Identify and characterize failure mechanisms such as solder joint cracking, delamination, voiding, package warpage, die cracking, underfill defects, RDL, TSV, bump, and interconnect failures.
• Provide technical guidance on advanced failure analysis techniques and methodologies.

Root Cause Analysis & Problem Solving

• Drive structured root cause investigations using 8D, DMAIC/Six Sigma, FMEA, and Fishbone Analysis methodologies.
• Lead the implementation of effective Corrective and Preventive Actions (CAPA).
• Eliminate recurring issues and drive sustainable corrective actions.

Cross-Functional Collaboration

• Collaborate closely with Process Engineering, Product Engineering, Manufacturing, Test Engineering, Quality, and Reliability teams.
• Support New Product Introduction (NPI), qualification activities, and technology transfers.
• Partner with customers, suppliers, subcontractors, and internal stakeholders on joint investigations and improvement initiatives.

Customer & Escalation Management

• Serve as the technical lead for customer-related FA issues and escalations.
• Present failure analysis findings, root causes, and corrective action plans to customers.
• Ensure professional and effective communication with all stakeholders.
• Deliver solutions that meet customer expectations and industry standards.

Data Analytics & Continuous Improvement

• Analyze FA data to identify defect trends, systemic issues, and improvement opportunities.
• Drive yield improvement, defect reduction, and reliability enhancement initiatives.
• Apply statistical and data-driven methodologies to support decision-making.
• Continuously improve FA capabilities, processes, and operational efficiency.

Laboratory Operations & Capability Development

• Manage FA laboratory operations, including equipment maintenance, calibration, and utilization.
• Ensure compliance with ESD requirements, safety regulations, internal procedures, and audit standards.
• Lead laboratory capability expansion to support emerging technologies and business needs.
• Manage budget planning and capital investment for FA equipment and tools.

Performance Monitoring & Reporting

• Define, monitor, and report key performance indicators (KPIs), including:

  • Failure Analysis Turnaround Time (TAT)
  • Root Cause Closure Rate
  • Customer Escalation Resolution
  • Yield Improvement Contribution

• Prepare regular performance reports for management and stakeholders.

• Maintain documentation integrity and audit readiness.

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Qualifications & Experience

• Bachelor's or Master's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, or a related discipline.
• Minimum 8–15 years of experience in Semiconductor Failure Analysis (FA), Backend Manufacturing, Advanced Packaging, or related semiconductor operations.
• Strong understanding of failure mechanisms, material interactions, semiconductor packaging, and assembly processes.
• Hands-on experience with FA equipment and techniques, including SEM, FIB, TDR, CSAM, X-Ray, mechanical cross-sectioning, grinding, wet etching, and other advanced FA methodologies.
• Proven experience supporting high-volume manufacturing environments and key customer programs.
• Demonstrated leadership experience in managing technical teams, driving problem resolution, and handling customer escalations.

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Preferred Qualifications

• Experience in Bumping, Wafer-Level Packaging (WLP), and Advanced Packaging technologies.
• Exposure to OSAT (Outsourced Semiconductor Assembly and Test) or semiconductor foundry environments.
• Experience working with global customers and cross-functional international teams.
• Familiarity with advanced failure analysis tools, characterization techniques, and methodologies.
• Knowledge of quality and problem-solving methodologies such as 8D, FMEA, Six Sigma, and CAPA.

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Key Competencies

• Strong analytical, troubleshooting, and root cause analysis skills.
• Effective leadership, coaching, and team development capabilities.
• Excellent communication, presentation, and stakeholder management skills.
• Customer-focused mindset with strong business acumen.
• Data-driven decision-making and continuous improvement orientation.
• Ability to thrive in a fast-paced manufacturing environment and manage multiple priorities effectively.

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What We Offer

At TF AMD MICROELECTRONICS (PENANG) SDN. BHD., we are committed to providing our employees with a rewarding and fulfilling work environment.

Our benefits include:

• Competitive salary and performance-based rewards
• Comprehensive medical and dental coverage
• Generous annual leave entitlement and public holiday benefits
• Professional development and career advancement opportunities
• Exposure to advanced semiconductor technologies and global customers
• Collaborative and inclusive workplace culture

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About Us

TF AMD MICROELECTRONICS (PENANG) SDN. BHD. is a leading semiconductor assembly and test company specializing in advanced packaging and microelectronics manufacturing solutions. We are committed to innovation, quality, and operational excellence, delivering cutting-edge products and services to customers worldwide.

Join our team and be part of a company that is shaping the future of semiconductor technology through innovation, collaboration, and continuous improvement.

Apply now and take the next step in your engineering leadership career.