Section Manager Quality Engineering (Failure Analysis & Reliability)

JOB RESPONSIBILITIES:

Leadership & Team Management

• Lead, mentor, and develop a team of Failure Analysis (FA) engineers, technicians, and specialists.
• Establish clear goals, KPIs, and priorities aligned with business objectives and customer requirements.
• Manage manpower planning, workload distribution, and competency development programs.
• Foster a culture of technical excellence, accountability, collaboration, and continuous improvement.

Failure Analysis Operations

• Oversee end-to-end failure analysis activities, including customer returns (RMA), electrical failures, assembly and packaging defects, and reliability test failures.
• Ensure timely turnaround while maintaining high-quality analysis standards.
• Review, validate, and approve FA reports prior to release to customers and stakeholders.
• Establish and maintain standardized FA methodologies, workflows, and documentation practices.

Advanced Packaging Failure Analysis

• Lead failure investigations for advanced semiconductor packaging technologies, including Flip Chip (FC/FC-BGA), Wafer-Level Chip Scale Package (WLCSP), Fan-Out (FO), System-in-Package (SiP), BGA, and related technologies.
• Identify and characterize failure mechanisms such as solder joint cracking, delamination, voiding, package warpage, die cracking, underfill defects, RDL, TSV, bump, and interconnect failures.
• Provide technical guidance on advanced failure analysis techniques and methodologies.

Root Cause Analysis & Problem Solving

• Drive structured root cause investigations using 8D, DMAIC/Six Sigma, FMEA, and Fishbone Analysis methodologies.
• Lead the implementation of effective Corrective and Preventive Actions (CAPA).
• Eliminate recurring issues and drive sustainable corrective actions.

Cross-Functional Collaboration

• Collaborate closely with Process Engineering, Product Engineering, Manufacturing, Test Engineering, Quality, and Reliability teams.
• Support New Product Introduction (NPI), qualification activities, and technology transfers.
• Partner with customers, suppliers, subcontractors, and internal stakeholders on joint investigations and improvement initiatives.

Customer & Escalation Management

• Serve as the technical lead for customer-related FA issues and escalations.
• Present failure analysis findings, root causes, and corrective action plans to customers.
• Ensure professional and effective communication with all stakeholders.
• Deliver solutions that meet customer expectations and industry standards.

Data Analytics & Continuous Improvement

• Analyze FA data to identify defect trends, systemic issues, and improvement opportunities.
• Drive yield improvement, defect reduction, and reliability enhancement initiatives.
• Apply statistical and data-driven methodologies to support decision-making.
• Continuously improve FA capabilities, processes, and operational efficiency.

Laboratory Operations & Capability Development

• Manage FA laboratory operations, including equipment maintenance, calibration, and utilization.
• Ensure compliance with ESD requirements, safety regulations, internal procedures, and audit standards.
• Lead laboratory capability expansion to support emerging technologies and business needs.
• Manage budget planning and capital investment for FA equipment and tools.

Performance Monitoring & Reporting

• Define, monitor, and report key performance indicators (KPIs), including:
• Failure Analysis Turnaround Time (TAT)
• Root Cause Closure Rate
• Customer Escalation Resolution
• Yield Improvement Contribution
• Prepare regular performance reports for management and stakeholders.
• Maintain documentation integrity and audit readiness.

JOB QUALIFICATIONS:

• Bachelor's or Master's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, or a related discipline.
• Minimum 8–15 years of experience in Semiconductor Failure Analysis (FA), Backend Manufacturing, Advanced Packaging, or related semiconductor operations.
• Strong understanding of failure mechanisms, material interactions, semiconductor packaging, and assembly processes.
• Hands-on experience with FA equipment and techniques, including SEM, FIB, TDR, CSAM, X-Ray, mechanical cross-sectioning, grinding, wet etching, REL tester and other advanced FA methodologies.
• Proven experience supporting high-volume manufacturing environments and key customer programs.
• Demonstrated leadership experience in managing technical teams, driving problem resolution, and handling customer escalations.

Preferred Experience:

• Experience in Bumping, Wafer-Level Packaging (WLP), and Advanced Packaging technologies.
• Exposure to OSAT (Outsourced Semiconductor Assembly and Test) or semiconductor foundry environments.
• Experience working with global customers and cross-functional international teams.
• Familiarity with advanced failure analysis tools, characterization techniques, and methodologies.
• Knowledge of quality and problem-solving methodologies such as 8D, FMEA, Six Sigma, and CAPA.

Key Competencies:

• Strong analytical, troubleshooting, and root cause analysis skills.
• Effective leadership, coaching, and team development capabilities.
• Excellent communication, presentation, and stakeholder management skills.
• Customer-focused mindset with strong business acumen.
• Data-driven decision-making and continuous improvement orientation.
• Ability to thrive in a fast-paced manufacturing environment and manage multiple priorities effectively.

Remark: Open position for Bayan Lepas & Batu Kawan plant.