Semicon Pre-assembly Equipment Engineer

Job :

• Perform line sustaining job function on set-up, conversion and Wafer SAW Laser Groove backgrind equipment repair to support production loading.

• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.

• Communicate with Associate Engineers / Technical Specialist and external vendors to resolve problems.

• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.

• Experience in operation from wafer fab is preferred.

Requirement :

• Diploma/Degree in Electrical / Electronics / Mechanical Engineering or equivalent.

• Minimum 2 years of Wafer saw , Laser groove , and back grinding machines. equipment maintenance experience in wafer fab or wafer bumping for backend operations.

• Had keen to share improvement equipment knowledge and further improve on machine design improvement through machine modification.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to [email protected] stating

1. Current Drawn

2. Expecting Salary

3. Date Available

4. Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Jovian Tay Ling Ling

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: [6950 9742](tel:6950 9742)

www.peopleprofilers.com

EA License Number: 02C4944

EA Personnel Reg nos R1110579

Job ID: JOB-01078