Senior Debug Technician / Engineer

1. Instrument System Troubleshooting and Fault Isolation

• Perform systematic troubleshooting, diagnosis, and fault isolation for failed instrumentation products during assembly, functional testing, burn-in, final testing, rework, and RMA activities.
• Analyze failures from system level down to module, sub-assembly, PCBA, circuit, component, cable, connector, sensor, optical, mechanical, pneumatic, or other relevant levels.
• Reproduce reported failure symptoms where necessary and establish clear failure conditions before commencing detailed troubleshooting.
• Determine whether failures originate from electronics, power supply, wiring, connectors, sensors, optical components, mechanical assemblies, pneumatic systems, firmware/software interaction, workmanship, process conditions, or system integration.
• Apply structured diagnostic methods and measurement techniques rather than relying on trial-and-error replacement of parts.
• Compare failed units with known-good units, reference measurements, specifications, or system performance requirements where appropriate.
• Escalate complex or unresolved technical issues with clear diagnostic findings and supporting evidence.

2. PCBA and Electronic Circuit Troubleshooting

• Perform detailed PCBA troubleshooting where failures are suspected to originate from electronic circuits or components.
• Read and interpret electrical schematics, circuit diagrams, PCB layouts, BOMs, wiring diagrams, test points, and technical specifications.
• Diagnose abnormal power rails, signals, communication interfaces, open/short circuits, intermittent connections, component failures, soldering defects, damaged tracks, connector problems, and other electronic abnormalities.
• Use appropriate diagnostic equipment such as digital multimeters, oscilloscopes, DC power supplies, signal generators, logic analyzers, and other electronic test instruments.
• Identify defective components or circuit sections and recommend appropriate repair or replacement actions.
• Verify repaired PCBAs before reintegration into the instrument and confirm proper system-level functionality following repair.

3. Mechanical, Optical and System Integration Diagnosis

• Support troubleshooting of non-PCBA-related failures involving mechanical assemblies, cables, connectors, sensors, actuators, power supplies, optical components, pneumatic components, and other instrument subsystems.

• Evaluate assembly alignment, mechanical fit, connection integrity, cable routing, sensor response, and subsystem interaction when investigating instrument failures.

• Support troubleshooting of optical or photonics-related modules and components where applicable to the instrument.

• Work with the relevant engineering discipline when specialized analysis is required while retaining ownership of the overall failure investigation and follow-up.

4. Root Cause Analysis and Corrective Action

• Lead or support structured root-cause analysis for significant, recurring, or difficult instrument failures.
• Collect and analyze failure symptoms, measurements, production history, repair findings, test data, and other relevant information.
• Apply appropriate problem-solving methodologies such as 5 Why, Fishbone Analysis, 8D, fault-tree analysis, or other structured techniques.
• Distinguish between immediate failure symptoms and the actual underlying root cause.
• Work with Product Engineering, Process Engineering, Production, Quality, and other relevant teams to define effective containment, corrective, and preventive actions.
• Track technical corrective actions to closure and verify their effectiveness.

5. Rework, Repair and RMA Support

• Participate in technical review of production rejects, rework units, and customer-returned/RMA instruments.
• Assess failure conditions and determine suitable troubleshooting, repair, recovery, or rework approaches.
• Define or support technically sound repair and rework solutions together with Product Engineering, Process Engineering, and Quality.
• Prepare or support preparation of repair instructions, rework procedures, diagnostic guidelines, and verification requirements.
• Ensure approved repair and rework methods are properly implemented and controlled.
• Verify that repaired or reworked instruments meet applicable functional and performance requirements before release.
• Analyze repeated RMA and rework cases to identify systemic problems and opportunities for improvement.

6. Production and Test Engineering Support

• Provide hands-on troubleshooting support to Production and Test teams for instrument failures occurring during manufacturing.
• Respond promptly to production-stopping, high-priority, or recurring technical issues.
• Assist in determining whether failures are caused by product, PCBA, component, process, assembly, workmanship, test setup, or system integration issues.
• Support temporary containment actions where required to maintain production while permanent solutions are being developed.
• Work with Process Engineers and Product Engineers to implement corrective solutions and confirm effectiveness on the production floor.
• Support engineering builds, pilot builds, trial runs, and product ramp-up activities where troubleshooting or failure analysis capability is required.
• Provide technical feedback to production teams regarding common failure modes and appropriate first-level troubleshooting practices.

7. Failure Analysis Documentation and Traceability

• Maintain complete and accurate records of failure symptoms, diagnostic steps, measurements, identified root causes, repair actions, and verification results.
• Prepare clear debug reports, failure analysis reports, repair records, and technical investigation summaries.
• Ensure failure records provide sufficient technical evidence and traceability for engineering, quality, supplier, and management review.
• Maintain or contribute to a database of known failure modes, troubleshooting methods, and confirmed solutions.

8. Failure Trend and Data Analysis

• Categorize instrument failures by failure mode, subsystem, root cause, component, supplier, process, or other relevant criteria.
• Monitor recurring defects and support Pareto and trend analysis to identify high-frequency or high-impact failure modes.
• Identify patterns that may indicate systemic component, supplier, manufacturing, or process weaknesses.
• Provide failure data and technical insights to Product Engineering, Process Engineering, Quality, and Production for improvement actions.

9. Supplier and EMS Technical Support

• Work with Quality, Purchasing, Product Engineering, and external EMS / PCBA / component suppliers when failures are potentially supplier-related.
• Provide clear failure symptoms, photographs, measurements, defective samples, and other technical evidence to support supplier investigations.
• Support technical evaluation of supplier failure analysis, root-cause findings, and corrective action reports.
• Verify the effectiveness of supplier corrective actions through follow-up testing or production monitoring where appropriate.
• Highlight recurring supplier-related defects and support escalation when corrective actions are ineffective.

10. Repairability and Diagnostic Improvement

• Identify opportunities to improve the diagnosability and repairability of instruments.
• Develop and maintain structured troubleshooting sequences, diagnostic checklists, known-failure guides, and repair references.
• Recommend additional test points, inspection checkpoints, diagnostic tools, fixtures, or test coverage where they can reduce troubleshooting time or prevent defect escape.
• Work with relevant engineering teams to simplify repetitive troubleshooting activities and improve debug efficiency.
• Support development of standard repair methods for recurring and technically understood failures.

11. Continuous Improvement and Defect Prevention

• Analyze recurring production, test, rework, and RMA failures and recommend improvements to reduce defect recurrence.
• Support corrective actions aimed at improving first-pass yield, product reliability, manufacturing robustness, and repair turnaround time.
• Work with Process Engineering to identify process-related contributors to instrument failures.
• Work with Product Engineering where product-related technical changes are required to eliminate recurring failures.
• Recommend improvements to assembly methods, testing coverage, inspection criteria, workmanship controls, or handling practices based on failure findings.

12. Cross-Functional Technical Coordination

• Work closely with Product Engineering, Process Engineering, Test Engineering, Production, Quality, Purchasing, Warehouse, and suppliers to resolve instrument-related failures.
• Communicate technical findings clearly and objectively to relevant stakeholders.
• Participate in technical review meetings related to production failures, rework, RMA, supplier defects, and recurring reliability issues.
• Follow through assigned technical actions to ensure issues are properly closed rather than only temporarily recovered.

Job Requirement

• Minimum Diploma in Electrical & Electronic Engineering, Electronics, Mechatronics, Instrumentation, Automation, or a related technical field.
• Minimum 4 years of relevant experience in equipment troubleshooting, electronic repair, debug, test engineering, or a related technical role; semiconductor or manufacturing experience is preferred.
• Hands-on experience in PCBA troubleshooting, soldering, component replacement, and electronic circuit fault isolation is an advantage.
• Able to read and interpret electrical schematics, wiring diagrams, PCB layouts, BOMs, and technical documentation.
• Familiar with using test and measurement equipment such as digital multimeters, oscilloscopes, and DC power supplies.
• Good understanding of electronic, electrical, mechanical, and electromechanical systems.
• Strong troubleshooting, problem-solving, analytical, and root cause analysis skills.
• Familiar with structured problem-solving methods such as 5 Why, Fishbone, or 8D is an advantage.
• Good communication and teamwork skills with the ability to work effectively with Engineering, Production, Quality, and other cross-functional teams.
• Detail-oriented, responsible, proactive, and able to work independently with minimal supervision.
• Able to work under pressure and respond effectively to urgent production or technical issues.
• Good command of English; Mandarin is an added advantage.