Senior Engineer Board Level Reliability

Support and manage reliability testing, thermal characterization, SMT processes, and failure analysis activities to ensure product quality and reliability. Drive test execution, equipment maintenance, data analysis, and continuous improvement while developing test fixtures and delivering technical reports to support engineering and customer requirements.

Your role
Key responsibilities in your new role

• Execute and manage Board Level Reliability (BLR) projects, including Temperature Cycling on Board (TCoB), Drop Test, Board Bending Test, and Vibration Test.
• Perform and manage Package Thermal Characterization activities, including measurement and analysis of thermal parameters such as Theta JA, Theta JB, Theta JC, Psi JB, and Psi JT.
• Support Surface Mount Technology (SMT) processes, including solder paste printing, pick-and-place operation, reflow profile development and optimization, and X-ray inspection.
• Conduct Failure Analysis (FA) investigations using techniques such across-sectioning, SEM, EDX, SAM, package decapsulation, dye & pry analysis, and parallel mapping.
• Perform preventive maintenance, calibration, and troubleshooting of reliability, thermal characterization, and laboratory equipment.
• Design and develop test fixtures, jigs, and tooling using 3D CAD software (e.g., SolidWorks).
• Prepare technical reports, test documentation, procedures, and project updates in accordance with company standards.
• Analyze test data, draw conclusions, and present findings to internal and external stakeholders.

Your profile
Qualifications and skills to help you succeed

• Bachelor's or Master's Degree in Electronics Engineering, Mechanical Engineering, Materials Engineering, Physics, or a related technical field.
• Minimum 3 years of relevant experience in semiconductor package development, reliability engineering, failure analysis, thermal characterization, or related areas.
• Strong knowledge of Board Level Reliability (BLR) testing methodologies and industry standards. Hands-on experience with SMT assembly processes and reliability test equipment.
• Practical experience in Failure Analysis techniques, including SEM, EDX,SAM, cross-sectioning, and package decapsulation.
• Proficiency in 3D CAD design software, preferably SolidWorks.
• Familiarity with data analysis tools such as Microsoft Excel, Minitab, JMP, Python, or equivalent analytical software.
• Strong documentation and technical report-writing skills.
• Good project management and problem-solving capabilities.
• Effective communication and presentation skills with the ability to communicate technical information clearly in English.
• Ability to work independently, manage multiple projects, and collaborate effectively in a cross-functional and international environment.
• Experience in semiconductor package qualification, automotive reliability, or power semiconductor products. Knowledge of JEDEC, AEC-Q100/Q101, IPC, and other relevant industry standards.
• Experience working in a multinational semiconductor manufacturing environment.