Senior Engineer, NPI (Semiconductor Assembly & EOL)

MAIN RESPONSIBILITIES

• Review RFQ prepared by Project Management (PM) team – on EOL technical related item.

• Review TGA – on EOL related item.

• Attend con-call with customer and share project / action item updates.

• Liaise with internal cross functional department, supplier and customer on EOL related items.

• Support on EOL related item:

• BOM / Plan ID / Flow chart review and approval.

• Update Package packing spec and tool buyoff (Pick and Place / Laser Mark / Mold / etc)

• Support new product introduction (NPI), process transfer, and mass production

• Prepare Eng Validation and / or Qual report for NPI / newly develop package.

• Process monitoring and enhancement to ensure NPI / newly develop project meet yield target of min 98.5%.

• Work pro-actively with FOL NPI team / Package Development team / EOL Technician in order to ensure project run smoothly and released on time.

• Liaise with respective cross-functional groups: PM / Planner / QA / Prod / Process / Maintenance / Tooling department in order to ensure builds are completed on time.

TECHNICAL SKILLS & COMPETENCIES

Data Analysis & Interpretation

• EOL Process (Mold / Laser Mark / Singulation / Pick & Place) knowledge is an advantage
• Data Collection, organization and interpretation data to support decision-making

Failure Analysis & Root Cause Investigation

• Ability to analyze product excursions and drive corrective actions.
• Use of statistical tools (SPC, DOE, FMEA, Six Sigma).

Yield & Quality Improvement

• Ramp-to-yield entitlement management.
• Continuous improvement in cycle time, yield, and product quality.

REQUIREMENTS

• Bachelor's Degree in Engineering (Electrical, Electronics, Mechatronics, Manufacturing, Mechanical, or related discipline).
• Experience in semiconductor manufacturing, assembly, test, or NPI environment is an added advantage.