Senior Engineer, Optical Interconnect Integration

DUTIES & RESPONSIBILITIES:

• Develop integrated structural solutions for high-density passive all-optical connectivity (for CPO/NPO/OIO AI computing scenarios), including structural design and optimization of glass-based optical interconnect, heterogeneous integration of passive Chiplet optical engines, and multi-passive-device coupling integration.
• Develop high-density-compatible optical interface structures and fiber alignment coupling structures to meet ultra-high bandwidth passive all-optical connectivity requirements for AI computing, solving the structural challenges of size matching and low-loss coupling between passive photonic components and fibers/optical waveguides.
• Collaborate with optical R&D and packaging process teams to complete integration solution verification, optimize process compatibility of integrated structures, and balance integration density, manufacturing cost and product stability.
• Responsible for reliability verification of integrated passive optical interconnect structures, track test results to complete structural iteration, and output complete structural design documents and process specifications.
• Track cutting-edge passive optical interconnect integration technologies (such as Corning Glass Bridge glass-based optical interconnect solution), complete technical pre-research and adapt solutions to the company's product roadmap.

SCOPE: Focus on passive optical interconnect integration structure R&D for high-density all-optical connectivity, no circuit design or active chip-level R&D arrangements EDUCATION: REQUIRED: Bachelor's degree or above in Mechanical Engineering, Electronic Packaging, Optoelectronic Engineering or related fields PREFERRED: None WORK EXPERIENCE: REQUIRED: 3+ years of R&D experience in semiconductor/optoelectronic integrated passive structure development PREFERRED: Experience in CPO/silicon photonic passive interconnect integration development is preferred SKILLS & ABILITIES: REQUIRED:

• Bachelor's degree or above in Mechanical Engineering, Electronic Packaging, Optoelectronic Engineering or related fields, with 3+ years of R&D experience in semiconductor/optoelectronic integrated passive structure development; experience in CPO/silicon photonic passive interconnect integration development is preferred.
• Proficient in NX/SolidWorks or other structural design tools, master structural simulation and cumulative tolerance analysis methods, and understand basic principles of optical coupling.
• Familiar with structural design requirements for heterogeneous integration and advanced packaging of passive components, and understand the structural processing characteristics of different substrates such as glass substrates and silicon substrates.
• Strong technical pre-research ability and troubleshooting capability, able to independently drive integrated structural project delivery and collaborate smoothly across teams.

PREFERRED:

• Experience in silicon photonic packaging or passive optical engine packaging is preferred

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