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Senior Engineer (RTH), Packaging Process

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Onsite

Senior Engineer (RTH), Packaging Process

Hong Kong Microelectronics Research and Development Institute Company Limited

Senior Engineer (RTH), Packaging Process

Skills

R

2 months ago

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Important information


Contract type:

Permanent

Work mode:

Onsite

Published on:

21 August 2026

What they need


Hong Kong Microelectronics Research and Development Institute (MRDI) is established to seize the huge potential market for third-generation semiconductors and align with the national strategy for technological development.

The vision is for the MRDI to play a leading role in strengthening collaboration with the industry, academia, and research sectors, expediting the "1 to N" transformation of scientific research outcomes, promoting technological innovation, and assisting the industry in enhancing efficiency as well as achieving upgrading and transformation.

The MRDI is looking for a dynamic and high-calibre professional to fill the position of Senior Engineer (RTH), Packaging Process. 

KEY RESPONSIBILITIES

  • Hands-on operation and maintenance of power semiconductor packaging equipment (e.g., die bonding, wire bonding, vacuum soldering, encapsulation, and molding systems).
  • Utilise Design of Experiments (DOE) methodologies to systematically plan trials, optimise process parameters, and troubleshoot packaging defects.
  • Perform reliability and failure analysis using advanced tools (e.g., SAM, X-ray, SEM, thermal cycling, and electrical characterisation
  • Assist in ITF R&D project implementation as assigned.
  • Perform other duties as assigned by supervisors.

REQUIREMENTS

  • A PhD degree in Materials Science, Microelectronics, Mechanical Engineering, Electrical Engineering, or a related discipline.
  • Proven and hands-on experience in operating power semiconductor packaging and assembly equipment is a strict requirement; strong proficiency in statistical analysis and DoE methodology.
  • Deep understanding of power electronics packaging materials (solder, sinter paste, substrates, wire bonds) and thermal management.
  • A collaborative team player with outstanding interpersonal skills.
  • Good written and verbal communication skills in Chinese and English (including Putonghua and Cantonese).

WORKING LOCATION

  • Head Office at Hong Kong Science Park, and
  • Microelectronics Centre at Yuen Long InnoPark

NOTE: The actual position offered will be commensurate with the applicant's qualifications and experience.

Salary will be commensurate with qualifications and experience. The incumbent will normally work five days a week. The initial employment contract spans 12 months and can be renewed with a longer tenure upon mutual agreement of the incumbent and MRDI.

APPLICATION PROCEDURE

To apply, please submit the applications via JobsDB by 20 September2026. Please specify the present/ latest salary and expected salary in the CV. Only shortlisted candidates will be notified of the result of the application. MRDI reserves the right not to fill the position.

MRDI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment only.

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