Senior Engineer Unit Process Development Singulations

#WeAreIn for jobs that impact everyone's life.

What if your ideas could change the way the world connects, powers up, or thinks?

As a Senior Engineer Unit Process Development Singulations in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

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Your role
Key responsibilities in your new role

• Perform process development activities, including process parameter scouting, optimization, verification, and process freeze, to meet project targets in timeline, quality, cost competitiveness, and manufacturability.

• Drive qualification and implementation of:

• Tape-based singulation processes

• Tapeless singulation solutions

• Laser singulation technologies

• Hybrid singulation approaches

• Support technical handover and knowledge transfer to Operations.

• Generate and maintain relevant documentation, including Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, and PDR.

• Support prototype and development sample builds.

• Evaluate emerging singulation technologies and establish technology readiness for industrial deployment.

• Provide input and ensure accuracy of related documents, including Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, Maintenance Checklist, and Unit Process Roadmap for development projects.

• Liaise with suppliers to drive continuous improvement and perform verification and qualification activities for new tooling, machines, and materials in development projects.

• Identify and develop new process technologies and improve process capability to meet business requirements.

• Benchmark industry best practices and identify opportunities for competitive advantage.

• Provide technical guidance and mentorship to engineers and project teams.

• Serve as the primary technical expert for package singulation technology, driving the development of high-performance, cost-effective, and scalable semiconductor package manufacturing solutions.

Your profile
Qualifications and skills to help you succeed

• Minimum 10 years of experience in semiconductor backend assembly and package development.

• Minimum 5 years of direct experience in package singulation process development.

• Proven hands-on expertise in:

• Tape-based singulation

• Tapeless singulation

• Laser singulation

• Experience supporting high-volume semiconductor manufacturing environments.

• Demonstrated track record in process development, industrialization, and yield improvement.

• Experience with the following singulation technologies:

• Blade dicing and saw singulation

• Tape-based package singulation

• Tapeless package handling and singulation

• UV and IR laser singulation processes

• Stealth and advanced laser dicing technologies

• Multi-package and panel-level singulation strategies

• Experience working with major singulation equipment suppliers and laser technology providers is an added advantage.

• Strong technical leadership and ability to influence without direct authority.

• Strategic thinking and technology roadmap planning capabilities.

• Excellent problem-solving and analytical skills.

• Strong stakeholder management and communication skills.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
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