Senior FA & REL Engineer (Failure Analysis & Reliability)

About the role

As a Senior Failure Analysis Engineer at TF AMD MICROELECTRONICS (PENANG) SDN. BHD., you will play a crucial role in identifying and resolving complex electrical and electronic engineering challenges. This full-time position is based in Penang (Batu Kawan) and offers the opportunity to work on cutting-edge technology and contribute to the company's continued success.

What you'll be doing:

1. Perform comprehensive failure analysis on semiconductor devices, advanced packages, or electronic systems across development and production stages
2. Plan and execute electrical, physical, and material analyses using advanced FA techniques
3. Independently conduct root cause analysis (RCA) and document clear, data-driven conclusions
4. Utilize FA tools such as SEM, FIB, EDX, lock-in thermography, X-Ray, and probing techniques
5. Interpret schematics, layouts, and test data to correlate failure mechanisms
6. Support customer complaints, reliability issues, and qualification failures with timely and high-quality FA reports
7. Drive corrective and preventive actions (CAPA) with cross-functional teams (Design, Process, Product, Manufacturing, Test)
8. Develop and improve FA methodologies, best practices, and lab capabilities
9. Mentor junior FA engineers and provide technical guidance as needed
10. Ensure compliance with lab safety, quality, and documentation standards

Job Requirements:

• Bachelor’s or Master’s Degree in Electrical, Electronics, Materials, Mechanical Engineering, or related field.

• Minimum 8 years of experience in semiconductor FA/ REL, backend manufacturing, or advanced packaging.

• Strong knowledge of failure physics, material interactions, and assembly processes.

• Hands-on experience with FA tools (SEM, FIB, TDR, CSAM, X-Ray, grinding, wet etch, etc.) and REL tester.

• Experience supporting high-volume manufacturing and key customer accounts.

• Proven leadership in managing technical teams and complex escalations.

Key Competencies:

• Advanced analytical and problem-solving skills

• Customer-focused with excellent communication skills

• Data-driven decision-making mindset

• Ability to perform under pressure in fast-paced manufacturing environments

Nice to Have:

• Experience in Bumping, Wafer Level, Advanced packaging
• Exposure to OSAT or foundry environments
• Experience working with global customers
• Familiar with advanced lab analytical tool and techniques