R
Ram Associates
Senior IC Substrate Package Layout Designer
6 days ago
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Important information
Contract type:
Permanent
Location:
Karnataka, India
Work mode:
Onsite
Published on:
18 October 2026
What they need
- Bachelor's or Master's degree in Electrical/Electronics Engineering or related field
- 4+ years of experience in IC package/substrate layout design
- Expert-level proficiency in Cadence Allegro Package Designer (APD/APD XL), SiP Layout, and Constraint Manager
- Strong understanding of substrate stackups, material selection, HDI technologies, via structures, package assembly processes, and reliability considerations
- Working knowledge of Signal Integrity, Power Integrity, impedance control, differential routing, PDN design, return path optimization, and crosstalk management
- Hands-on experience with high-speed interfaces including SerDes, PAM4, PCIe, DDR/LPDDR, HBM, Ethernet, CXL, USB, UCIe, and other multi-gigabit interfaces
Pay: ₹100,000.00 - ₹300,000.00 per month
Work Location: In person
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