Senior Manager / Manager, Semiconductor Packaging & Assembly Engineering

Locations: Bayan Lepas, Penang | Shah Alam, Selangor | Batu Berendam, Melaka
Employment Type: Permanent

Key Responsibilities

• Lead semiconductor packaging and assembly engineering activities for manufacturing operations.
• Drive yield improvement, defect reduction, quality enhancement, and cost optimization initiatives.
• Support New Product Introduction (NPI) and High Volume Manufacturing (HVM) ramp activities.
• Develop and improve assembly process controls and manufacturing best practices.
• Conduct root cause analysis and implement corrective and preventive actions.
• Support product, process, material, equipment, and site qualifications.
• Collaborate with internal teams and external manufacturing partners to resolve technical issues and improve manufacturing performance.
• Monitor manufacturing KPIs and drive continuous improvement programs.
• Lead cross-functional engineering projects and technical problem-solving activities.
• Provide technical leadership, coaching, and mentoring to engineering teams.

Requirements

• Bachelor's Degree in Engineering, Materials Science, Electronics, Electrical, Mechanical, Chemical Engineering, or related disciplines.

• Minimum 12 years of experience in semiconductor packaging, assembly engineering, manufacturing engineering, process engineering, or related semiconductor manufacturing environments. Candidates with 15+ years of experience and demonstrated technical leadership will be considered for Senior Manager level.

• Experience in semiconductor package assembly processes such as:

  • Wire Bond
  • Flip Chip
  • Die Attach
  • Molding
  • Singulation
  • SMT
  • Wafer Level Packaging (WLP)
  • System-in-Package (SiP)
  • Multi-Chip Module (MCM)

• Strong knowledge of:

  • Yield Improvement
  • SPC
  • DOE
  • FMEA
  • Root Cause Analysis
  • Reliability Engineering
  • Process Qualification
  • Statistical Analysis

• Experience supporting NPI-to-HVM transfer and product ramp activities.

• Experience working with OSATs or outsourced semiconductor manufacturing partners.

• Strong stakeholder management, communication, project management, and leadership skills.

• Experience in Power Semiconductor Packaging, Smart Power Stage (SPS), Vertical Power Stage (VPS), Power Modules, Discrete FET, SiC, GaN, or Advanced Packaging technologies will be an added advantage.

• Familiarity with JEDEC, IPC, Automotive, Industrial, and Power Semiconductor standards is preferred.