Michael Page International (HK) Ltd
Senior Mechanical Engineer- Semiconductor
Skills
22 days ago
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Important information
Contract type:
Permanent
Salary:
HK$455,000 – HK$585,000 / year
Work mode:
Onsite
Published on:
6 October 2026
What they need
With continuous investment in innovation and R&D, the company is expanding its engineering team and is seeking a Senior Mechanical Engineer to support new product development, module design, and technology advancement initiatives.
Client Details
Our client is a well-established multinational semiconductor company.
Description
- Lead the mechanical design and development of semiconductor assembly and packaging equipment modules from concept to production release.
- Participate in NPI (New Product Introduction) projects, ensuring product performance, reliability, manufacturability, and cost targets are achieved.
- Design and optimize precision mechanical systems, including wafer handling, pick-and-place, and motion-related modules.
- Conduct engineering calculations, simulations, tolerance analysis, and design verification activities.
- Collaborate with software, controls, process, manufacturing, and quality teams to deliver integrated engineering solutions.
- Support prototype builds, testing, troubleshooting, and design improvements based on customer feedback and field performance.
- Drive continuous improvement and cost reduction initiatives through design optimization and component standardization.
- Prepare engineering documentation, drawings, BOMs, specifications, and technical reports.
- Support supplier qualification and component selection activities for new projects.
Profile
- Bachelor's Degree or above in Mechanical Engineering, Mechatronics Engineering, or a related discipline.
- 5+ years of mechanical design experience within semiconductor equipment, automation equipment, precision machinery, or advanced manufacturing industries.
- Solid experience in product development, NPI, and mechanical module design.
- Hands-on experience in CAD software such as SolidWorks, Creo, Inventor, or similar platforms.
- Strong understanding of GD&T, tolerance stack-up analysis, machine assembly, and engineering fundamentals.
- Experience with wafer handling, die bonding, pick-and-place systems, or precision automation equipment is highly preferred.
- Good problem-solving skills with the ability to conduct root cause analysis and implement engineering solutions.
- Strong communication and stakeholder management skills.
- Proficiency in English and Chinese.
Job Offer
- Competitive compensation package with performance bonus.
- Regional and global project exposure within a multinational environment.
To apply online please click the 'Apply' button below. For a confidential discussion about this role please contact Chloe Cheung on +85225306134.
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