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Senior Mechanical Engineer- Semiconductor

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Onsite

Senior Mechanical Engineer- Semiconductor

Michael Page International (HK) Ltd

Senior Mechanical Engineer- Semiconductor

Skills

R

22 days ago

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Important information


Contract type:

Permanent

Salary:

HK$455,000 – HK$585,000 / year

Work mode:

Onsite

Published on:

6 October 2026

What they need


With continuous investment in innovation and R&D, the company is expanding its engineering team and is seeking a Senior Mechanical Engineer to support new product development, module design, and technology advancement initiatives.

Client Details

Our client is a well-established multinational semiconductor company.

Description

  • Lead the mechanical design and development of semiconductor assembly and packaging equipment modules from concept to production release.
  • Participate in NPI (New Product Introduction) projects, ensuring product performance, reliability, manufacturability, and cost targets are achieved.
  • Design and optimize precision mechanical systems, including wafer handling, pick-and-place, and motion-related modules.
  • Conduct engineering calculations, simulations, tolerance analysis, and design verification activities.
  • Collaborate with software, controls, process, manufacturing, and quality teams to deliver integrated engineering solutions.
  • Support prototype builds, testing, troubleshooting, and design improvements based on customer feedback and field performance.
  • Drive continuous improvement and cost reduction initiatives through design optimization and component standardization.
  • Prepare engineering documentation, drawings, BOMs, specifications, and technical reports.
  • Support supplier qualification and component selection activities for new projects.

Profile

  • Bachelor's Degree or above in Mechanical Engineering, Mechatronics Engineering, or a related discipline.
  • 5+ years of mechanical design experience within semiconductor equipment, automation equipment, precision machinery, or advanced manufacturing industries.
  • Solid experience in product development, NPI, and mechanical module design.
  • Hands-on experience in CAD software such as SolidWorks, Creo, Inventor, or similar platforms.
  • Strong understanding of GD&T, tolerance stack-up analysis, machine assembly, and engineering fundamentals.
  • Experience with wafer handling, die bonding, pick-and-place systems, or precision automation equipment is highly preferred.
  • Good problem-solving skills with the ability to conduct root cause analysis and implement engineering solutions.
  • Strong communication and stakeholder management skills.
  • Proficiency in English and Chinese.

Job Offer

  • Competitive compensation package with performance bonus.
  • Regional and global project exposure within a multinational environment.

To apply online please click the 'Apply' button below. For a confidential discussion about this role please contact Chloe Cheung on +85225306134.

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