Senior Package Design Engineer

• Package design and planning of various product. 2. Design & layout of BGA substrate. 3. Co-work with package houses for package design 4. Development of advanced package technology. 5. Package design platform development

Main Requirements and Qualifications

• 1. MS or above with major in EE, ME, or related field.
• 2. Familiar with Cadence APD/SiP and Autocad is a plus
• 3. Familiar with the design flow of package & BGA substrate is a plus.
• 4. Familiar with the structures of various packages is a plus: PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/Fanout.
• 5. Familiar with Cadence APD skill language is a plus.
• 6. Familiar with RD layout tool is a plus:
• Laker/Virtuoso