Senior Packaging Development Engineer

RESPONSIBILITIES:

• Design, develop and scale to volume production of new packages and modules for the industrial, automotive, renewable and telecom markets.
• The candidate can understand system requirements and build these into the definition of the package/power module to meet electrical, thermal, and mechanical specifications.
• Capabilities to independently use simulation software.
• Interact with internal cross-function teams, subcontractors and material suppliers to develop new packages, assembly processes and technologies.
• Optimize the assembly materials and processes with best package performance & reliability, maximize manufacturing yield, and minimize assembly cost.
• Benchmark the competitions in package design, assembly materials and assembly processes, and create a new methodology, technology and intellectual property.
• Direct support for multiple product lines and customers.

REQUIREMENTS:

• BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree.
• 3+ years of experience in design of packages and modules.
• Proficiency in CAD software: Auto CAD and SolidWorks preferred.
• Deep understanding in various packaging technologies, process flow, material, qualification and manufacturing implementation.
• Knowledge of thermal, electrical and mechanical finite FEA/CFD simulation software tools and simulation methods used for semiconductor packaging and board level applications.
• ANSYS Icepak/Q3D/Mechanical Preferred.
• System level simulation skill is a plus.
• Excellent communication, writing and presentation skills.
• Strong innovation, problem solving mindset.

Benefits:

• Attractive compensation.

• Supportive work environment where your ideas count, and you can thrive in a diverse culture.

• World of opportunities for your personal and professional development.