Senior PCB Design Engineer

Key Responsibilities

• Advanced PCB Design & Layout: Execute advanced layout for complex, high-density, and high-speed multi-layer boards (including HDI, blind/buried vias, and microvias).
• Perform rigorous constraint management for critical high-speed interfaces such as DDRx, PCIe, LVDS, etc.
• Optimize component placement for signal integrity (SI), power integrity (PI), thermal performance, and EMI/EMC control.
• Develop high-quality designs for various board types, including rigid, flex, and rigid flex configurations.
• Closely collaborating with electrical and mechanical teams to interpret requirements, resolve design issues, and implement simulation-driven layout changes.
• Work with PCB fabrication to ensure Design for Manufacturing (DFM) standards are met, optimizing stack-up, maximizing manufacturing yield, and reducing cost.
• Prepare and maintain comprehensive documentation packages for product release, including schematic diagrams, detailed assembly and fabrication drawings, Bills of Materials (BOMs), Gerber files, and ODB++ outputs.
• Maintain ECAD library, including the creation of precise schematic symbols and component footprints.
• Leverage CAD automation tools, with proficiency in Allegro SKILL scripting being a significant advantage, to enhance team efficiency and design quality.
• Perform layout planning and design reviews.

Job Requirements

• Experience: Minimum of five 3 years of professional, direct experience in complex PCB design and layout. Experience in industrial modules, power electronics, medical devices, and aerospace applications is highly desirable.
• Education: Bachelor’s Degree in Electrical Engineering, Electronics Engineering, or a related technical field.
• Software Expertise: Proficiency in industry-leading CAD systems, including Cadence Allegro/OrCAD and/or Altium Designer.
• Standards Knowledge: In-depth expertise in industry standards for PCB fabrication and assembly (e.g., IPC standards).
• Technical Acumen: Strong understanding of high-speed design techniques, impedance control, stack-up planning, and thermal/mechanical constraints.