Senior Process Engineer (NPI & Wafer Dicing)

Key Responsibilities

• Lead the wafer sawing process for New Product Introduction (NPI) projects from initial product evaluation through process qualification and production release.
• Develop, optimize, and validate wafer sawing process parameters, including blade selection, spindle speed, feed rate, and cutting depth, to achieve targeted yield, quality, and productivity.
• Conduct root cause analysis and implement corrective and preventive actions (CAPA) to resolve process issues such as wafer chipping, edge cracking, die shift, and yield loss.
• Plan and execute Design of Experiments (DOE) and process characterization activities to evaluate new materials, wafer thicknesses, and advanced dicing technologies, including laser grooving, stealth dicing, and hybrid dicing methods.
• Support equipment installation, setup, qualification, and buy-off activities to ensure readiness for new product introduction and compliance with customer specifications.
• Collaborate closely with cross-functional teams, including Process Engineering, Equipment Engineering, Quality Assurance, Production Planning, Manufacturing, and NPI Program Management, to ensure timely project execution and risk mitigation.
• Prepare, review, and approve process documentation, including Standard Operating Procedures (SOPs), work instructions, process flow documents, FMEA, and Control Plans.
• Monitor and analyze key manufacturing performance indicators such as yield, Overall Equipment Effectiveness (OEE), Units Per Hour (UPH), cycle time, and equipment downtime, and drive continuous improvement initiatives.
• Ensure compliance with customer requirements, quality standards, and internal manufacturing procedures throughout the NPI lifecycle.
• Provide technical guidance and mentoring to junior engineers and technicians while supporting knowledge sharing and capability development within the team.

Technical Skills & Competencies

• Strong knowledge of wafer sawing/dicing processes within the semiconductor assembly and test environment.
• Experience in New Product Introduction (NPI), process qualification, and production transfer.
• Proficient in Design of Experiments (DOE), Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA), and root cause analysis methodologies (8D, Fishbone, 5 Why).
• Knowledge of semiconductor packaging, SMT processes, and manufacturing process control is an advantage.
• Familiarity with wafer dicing equipment, tooling, and process optimization techniques.
• Strong analytical, problem-solving, and troubleshooting skills.
• Excellent cross-functional collaboration and stakeholder management abilities.
• Good project management, communication, and presentation skills.
• Ability to work independently in a fast-paced manufacturing environment while managing multiple NPI projects simultaneously.

Experience Requirement

• Minimum 5–8 years of experience in semiconductor manufacturing.
• At least 3 years in NPI, wafer sawing/dicing process engineering, or a similar technical role.
• Experience with wafer dicing equipment (e.g., DISCO, ADT, Synova) is highly preferred.
• Familiarity with DOE, SPC, FMEA, 8D, Six Sigma, and statistical process analysis.