Senior Process Engineer (Wafer Bumping Process)

About the role

Plating Process Engineering role focused on developing, implementing, and optimizing electroplating processes and supporting wet chemical operations including etching, cleaning, and stripping.

Key responsibilities

• Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.)
• Monitor plating bath performance through regular analysis and corrective actions
• Perform DOE, capability studies, and process qualification for new plating chemistry or equipment
• Lead troubleshooting activities for plating defects such as voids, roughness, nodule formation, non-uniformity, and poor adhesion
• Establish and maintain plating process parameters, SOPs, and control plans
• Support wet etching processes (acid, alkaline, micro-etch) and ensure etch rate stability and uniformity
• Optimize surface preparation steps prior to plating such as micro-etch, oxide removal, and plasma/aquatic cleaning
• Monitor and sustain wet chemistry tanks through SPC and scheduled chemical analysis
• Conduct chemical titration, CVS, TOC, and other plating bath analytical methods
• Analyze process data to identify trends and drive yield improvement actions

About you

• Experience with electroplating processes and wet chemistry operations
• Knowledge of DOE, capability studies, and process qualification
• Proficiency in laboratory analytical methods including chemical titration and microscopy
• Experience with SPC and statistical process control
• Familiarity with EHS guidelines for chemical handling, waste disposal, and safety compliance