TSP Talent

Role:
Process Integration Engineer in the Advanced DRAM organization, focusing on developing innovative memory solutions.
<ul>
<li>Responsibilities: Lead technology pathfinding for advanced device components, design experiments, analyze silicon results, evaluate failure mechanisms, develop new device architectures from conception to silicon, communicate complex issues effectively, and manage multiple project activities to meet objectives.</li>
<li>Qualifications: MS in Electrical Engineering, Physics, or related field with 3+ years in semiconductor industry; strong knowledge of memory technologies (DRAM, NAND, NOR, SRAM); proficiency in data analysis, DOE, and statistical techniques; solid understanding of materials science and device physics; experience with process integration and development; project management skills.</li>
<li>Preferred: Ph.D., experience in process integration or device engineering, especially in DRAM or NAND processes, and proven collaboration in dynamic team environments.</li>
</ul>
Skills:
Expertise in materials science, semiconductor physics, process development, and cross-functional team leadership.
This role involves driving innovation in memory device technology, developing new architectures, and managing technical projects within a collaborative environment.

Senior Process Integration Engineer, DRAM

Senior Process Integration Engineer, DRAM

This job is no longer available

Talents

Recruiters

About