Senior R&D Process Engineer

Role Overview

Applied Materials is seeking an experienced Senior R&D Process Engineer to support the development and implementation of next-generation semiconductor processes and technologies.

The successful candidate will have hands-on R&D or process development experience in areas such as Advanced Packaging, Hybrid Bonding, Etch, CVD, Thin Film Deposition, or other semiconductor process technologies. This position involves designing experiments, characterising equipment and processes, analysing data, troubleshooting complex technical problems, and collaborating with customers and cross-functional engineering teams.

Key Responsibilities

• Design, execute, and analyse complex semiconductor process engineering experiments in accordance with safety requirements.
• Support research and development activities for Advanced Packaging, Hybrid Bonding, Etch, CVD, Thin Film, or other semiconductor process technologies.
• Perform process and hardware characterisation across various semiconductor systems.
• Measure film properties, analyse experimental data, and interpret results to identify process improvements.
• Troubleshoot complex process and equipment-related issues.
• Conduct Root Cause Analysis and implement effective corrective and preventive actions.
• Develop and optimise new semiconductor processes, products, technologies, and analytical methods.
• Generate technical documentation, experimental reports, product presentations, and internal or customer-facing materials.
• Collaborate with customers to understand technical challenges and resolve complex process engineering issues.
• Work closely with hardware, software, product, and applications engineering teams.
• Identify, evaluate, and collaborate with vendors and suppliers.
• Support the transfer of newly developed processes and technologies into production.
• Ensure all experiments and development activities comply with quality and safety standards.

Requirements

• Master’s degree or PhD in Materials Science, Chemical Engineering, Chemistry, Physics, or a related technical discipline.

• A few years of relevant experience in semiconductor R&D, process development, or process engineering.

• Experience supporting semiconductor research and development activities.

• Technical experience in one or more of the following areas:

  • Advanced Packaging
  • Hybrid Bonding
  • Wafer Bonding
  • Etch or Plasma Processes
  • Chemical Vapour Deposition
  • Physical Vapour Deposition
  • Thin Film Deposition
  • Surface Preparation or Cleaning
  • Process Integration
  • Semiconductor Materials Characterisation

• Strong knowledge of Design of Experiments, process optimisation, data analysis, and Root Cause Analysis.

• Experience working with semiconductor processing equipment and hardware would be advantageous.

• Strong analytical and problem-solving capabilities.

• Good written and verbal communication skills.

• Ability to prepare and present clear technical reports and findings.

• Strong interpersonal skills and the ability to collaborate across global and cross-functional teams.

• Determined, quality-focused, and comfortable working in a fast-paced R&D environment.

• Must be willing to relocate to Singapore.