Senior Research Engineer (Interconnect & Assembly Integration), APM, IME

Long Description

About Us: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced packaging technologies for next-generation heterogeneous integration. Our research focuses on pioneering platforms such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, chiplet integration, co-packaged optics, and advanced power module packaging. At IME, you will have access to state-of-the-art semiconductor packaging facilities and play a key role in developing innovative assembly solutions for future electronic systems.

Position Overview We are seeking a highly motivated Research Engineer / Senior Research Engineer to develop, optimize, and integrate advanced assembly processes focusing on die attach, wire bonding, and flip chip technologies. The successful candidate will contribute to cutting-edge semiconductor packaging programs, enabling next-generation high-performance, high-reliability package solutions for diverse applications.

Project Collaboration

• Work closely with multidisciplinary teams including process integration, reliability, materials, design, and characterization engineers to deliver project objectives.
• Support customer engagements, joint development projects, and industry collaborations through technical discussions and experimental execution.

Key Responsibilities

• Develop and integrate advanced die attach, wire bonding, and flip chip assembly processes FOWLP, 2.5D/3D integration, chiplet packaging, photonics, and power electronics applications.
• Evaluate emerging assembly materials, interconnect technologies, and equipment capabilities to enhance package performance, reliability, and manufacturability.
• Conduct feasibility studies, to support new process development and platform expansion.

Establish Robust Process Solutions.

• Design and execute Design of Experiments (DOE) to optimize process parameters, material selection, and assembly recipes.
• Develop process control methodologies, characterization plans, and defect reduction strategies to improve yield, reliability, and throughput.

Intellectual Property and Technical Contributions.

• Generate detailed engineering reports, technical publications, and presentations to communicate research findings.
• Contribute to the development of intellectual property (IP), patents, and technical know-how in advanced semiconductor assembly technologies.

Customer and Market Engagement

• Collaborate with internal and external stakeholders to understand future packaging trends and customer requirements.
• Develop assembly capabilities that address emerging industry needs in heterogeneous integration, AI computing, photonics, and advanced power applications.

Requirements

• Bachelor's, or Master's in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Manufacturing Engineering, or a related discipline.
• Relevant experience in semiconductor assembly processes, including die attach, wire bonding, flip chip bonding, thermocompression bonding, or advanced packaging development.
• Strong analytical and problem-solving skills with a hands-on approach to process development.

Ability to work effectively in a multidisciplinary research and development environment.

Application Process Interested candidates should submit their resume and a cover letter detailing their relevant experience, technical expertise, and contributions to semiconductor assembly or advanced packaging technologies.