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Senior Semiconductor Packaging Engineer (m/f/d)

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Hybrid

Senior Semiconductor Packaging Engineer (m/f/d)

RiSusPro GMBH

Senior Semiconductor Packaging Engineer (m/f/d)

Skills

Compliance

15 days ago

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Important information


Location:

Munich, Germany

Work mode:

Hybrid

Published on:

12 October 2026

What they need


Munich
Job-Nr. RS-UHM-066

UNSER MANDANT

Our client is an international technology leader specializing in advanced materials and industrial joining solutions. We are seeking an experienced engineer or physicist (m/f/d) who would like to apply their expertise in semiconductor packaging and microelectronics to challenging development and customer projects.

Benefits:

  • A long-term role in a commercially successful company with a technically demanding working environment.
  • The opportunity to contribute to pioneering semiconductor applications, with a significantly broader remit than many traditional, highly specialized semiconductor roles.
  • Home office and hybrid working options.
  • Comprehensive onboarding covering the company’s specific materials and application technologies.
  • Strong team spirit, team events and company outings.
  • 30 days of annual leave and flexible working hours through flextime.
  • Health and fitness programmes.
  • A comprehensive benefits package, including additional payments, commuting allowances and subsidized canteen meals.
  • Extensive training opportunities.
  • State-of-the-art office and laboratory facilities.

IHRE AUFGABEN

In this position, you will take on complex technical challenges in the packaging of modern semiconductors and microelectronic components. Working with internal specialists and international customers, you will develop tailored solutions, conduct feasibility studies and guide new processes from initial trials to successful integration into the intended application. Your work will bring together materials, components and manufacturing processes.

The role is particularly well suited to specialists with practical experience in technologies such as Die attach, flip chip, underfill, encapsulation, wafer-level packaging, MEMS and sensor packaging, or comparable assembly and back-end processes. A sound understanding of thermomechanical behavior, material properties and reliability requirements in semiconductor applications would be an advantage.

You will have considerable scope to shape the technical work, direct contact with international customers and the opportunity to guide technological solutions from initial conception to industrial implementation.

IHR PROFIL

You hold a degree in physics, electrical engineering, microsystems engineering, materials science, process engineering, mechanical engineering, or a comparable engineering or natural science discipline. Ideally, you have at least five years of relevant professional experience in semiconductors, microelectronics or advanced packaging. Candidates from research institutions, semiconductor manufacturers, and packaging, equipment or materials companies are particularly welcome.

Alongside your technical expertise, you enjoy working with customers to develop new solutions. You can explain complex technical concepts clearly, enjoy collaborating across disciplines and feel equally comfortable in laboratory and development settings and in direct discussions with international technology companies. Excellent English language skills and a willingness to travel internationally complete your profile.

Interested? We look forward to receiving your detailed application documents. Please send them by email to [email protected]

If you have any questions in advance, please feel free to contact Mr. Sepp at +49 89 23 04 18 67.

Discretion, compliance with confidentiality notices, and professional advice are a matter of course for us.

About Us:

United Headhunters is a nationwide network of renowned recruitment consultancies with 10 locations and decades of experience in successfully filling specialist and management positions. Naturally, all our positions are exclusively permanent positions directly with our clients.

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