Senior Staff Engineer Module Package Development

Your role
Key responsibilities in your new role

• Develop and define package concepts for AI power-supply products, with an emphasis on high‑performance computing (HPC) modules.
• Validate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects.
• Coordinate and align new package ideas with Back-End development teams (internal and OSAT partners) and launch required assembly projects.
• Track and support package development projects through to final product release.
• Identify emerging development needs and translate them into additions/updates to the package roadmap.
• Serve as the technical point of contact for customer questions related to packaging.
• Stay current on packaging solutions by continuously monitoring market trends and conducting competitor benchmarking.
• Spot and assess business opportunities created by new technologies and packaging concepts.
• Lead the technical definition for major/new package projects (e.g., BOM, package design, assembly technology selection, PRP reviews, project classification), including risk and impact assessment.
• Define package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements.
• Act as a key interface to partners and technical consultants on package definition, particularly for Back-End assembly technology expertise.
• Support pre-development and project definition activities and remain the packaging design expert throughout the full project lifecycle.

Your profile
Qualifications and skills to help you succeed

• Bachelor’s degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with ~7+ years of relevant experience in assembly technologies.
• Strong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes).
• Working knowledge of SMT and PCB/module-related technologies.
• Expertise in semiconductor packaging, assembly, and test.
• Working knowledge on flip/chip process, package/strip grinding, molding
• Experience with failure analysis and reliability engineering.
• Strong analytical, statistical ( JMP, Minitab), and structured problem-solving skills.
• AutoCAD and 3D drafting skills preferred.
• Excellent communication and presentation skills, must be able to communicate effectively English ( Mandarin is a plus), both verbally and in writing.