Senior / Staff Engineer Package Technology

Key Responsibilities

In your new role, you will:

• Drive technical definition for package projects with major changes or new packages, including BOM, package design, assembly technology, PRP review and project classification.
• Generate conceptual package outlines and internal construction drawings, finalize and document drawings, and update package drawings as needed.
• Define package characteristics to meet electrical, thermal, reliability and mechanical requirements.
• Coordinate Package Cost Estimation and Cost Indication.
• Act as the contact partner for package definition, particularly on Back-End assembly technology know-how.
• Support pre-development and project definition and continue as the package design expert throughout the project phase.
• Actively scout for new packaging technologies and keep up with package development at competitors and subcontractors.
• Serve as the main contact for questions and discussions regarding packaging, package design and package roadmap.
• Drive innovation and pre-development activities within the package platform.

Requirements

You are best equipped for this role if you have:

• Minimum Bachelor’s Degree in Engineering, such as Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics or Physics.
• At least 7 years of relevant working experience in an IC/semiconductor environment.
• Strong knowledge of Semiconductor Packaging, Assembly and Test.
• Knowledge of Process and Equipment Engineering.
• Knowledge of Failure Analysis and Reliability Engineering.
• Strong analytical and problem-solving skills.
• AutoCAD and 3D drafting knowledge is preferred.