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Senior Staff Equipment Engineer (Grinding)

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Onsite

Senior Staff Equipment Engineer (Grinding)

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang

Senior Staff Equipment Engineer (Grinding)

Skills

SAP SuccessFactorsCompliance

14 days ago

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Important information


Contract type:

Permanent

Location:

Kulim, Kedah, Malaysia

Work mode:

Onsite

Published on:

14 October 2026

What they need


The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics.

At ams OSRAM, employees are part of a highly innovative, international technology environment. Diverse teams, a high degree of ownership, and exciting challenges provide the opportunity to grow, develop, and make a real difference. Because behind our innovations are people who carry something special inside and who bring their unique strengths to work every day.

Show the world what you are made of.

Your new responsibilities

  • Lead, develop and optimize dicing/ grinding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
  • To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirements.
  • Interaction with Process & Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process.
  • Drive for continuous improvement initiatives to reduce waste, increase tool up time efficiency and improve quality for dicing/ gridining area.
  • Collaborate with RBG counterparts to ensure both sites process changes is synchronized and develop future equipment strategy (CEPT/BEST) for dicing / grinding area which included procurement spec for equipment purchase, tool design improvement/PokaYoke, planning & execution within area of responsibility to support manufacturing activities.
  • Leads engineering efforts in support of the root cause identification of non-conformances. Will take ownership of implementing corrective and preventive action.

What we look for

  • Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering
  • Min. 10 years experience in manufacturing environment
  • Min. 5 years experience in dicing/ grinding process engineering

Please contact Shin Yih Cheah for further information via [email protected].

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