I
Infineon Technologies (Malaysia) Sdn Bhd
Senior Staff Package Definition Engineer
3 months ago
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Important information
Contract type:
Permanent
Location:
Malacca, Malaysia
Work mode:
Onsite
Published on:
10 August 2026
What they need
In your new role you will:
- Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks and impact.
- Generate conceptual package outline and internal construction drawings, finalise and document the drawings and update the package drawings as needed.
- Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
- Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
- Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
- Support pre development & project definition stage, and continue to be package design expert throughout project phase.
- Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.
You are best equipped for this task if you have:
- Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 7 years of relevant working experience in IC/semiconductor environment.
- Semiconductor Packaging, Assembly and Test.
- Process and Equipment Engineering knowledge.
- Failure Analysis and Reliability Engineering.
- AutoCAD and 3D drafting preferred
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