Senior/Process Engineer -Die Preparation

Key Job Accountabilities:

• Die Preparation (DP) Process Development, Optimization & Baseline Stabilization
• Wafer Backgrinding, Blade/Laser Dicing & Pick-and-Place Process Control
• New DP Process Qualification, Recipe Management & SOP Establishment
• Yield Enhancement, Defect Reduction & Root-Cause Failure Analysis (FA)
• Advanced Packaging / Thin-Wafer Handling & Fine-Pitch Dicing Capability Setup
• Technical Leadership, Team Building & Mentoring for Expanding DP Engineering Team
• Material (Tapes, Blades, Chemicals) & Vendor Technical Management

Required Experience and Qualifications:

• Bachelor’s degree or higher in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical/Electronic Engineering, or related disciplines
• R&D or mass production experience of at least 8 to 10 years in semiconductor process engineering, specifically in Die Preparation (DP), MEOL, or 2.5D/3D advanced packaging (CoW)
• Hands-on experience and deep process knowledge in unit operations: Wafer Backgrinding, Blade/Laser Dicing, Tape Lamination/Mounting, Die Attach, and Pick-and-Place
• Proven experience or strong potential in leading engineering teams, establishing new process flows, and allocating resources for expanding line operations
• In-depth technical capability in DP baseline process stabilization, recipe optimization, thin-wafer handling, and defect analysis (e.g., chipping, cracking, delamination, warpage control)
• Strong capability in raw material and vendor management, including qualification of dicing tapes, blades, and process consumables alongside equipment suppliers
• Excellent problem-solving skills in root-cause failure analysis (FA), process margin enhancement, yield optimization, and cross-functional collaboration with equipment and integration teams
• Proficiency in technical documentation and reading/writing/presenting in English for senior management and customer interactions