Service and Application Engineer

Responsibilities:

• Service and application support on LED Wafer/Die Probing, BIB Handler, Oven, Wire Bonding, Ball Mount, Dicing, Robots and others.
• Experienced on Dicing/Sawing is preferred.
• Managing customer account including service support on customer request, RMA and customer complaints.
• Co-work with customer and principal, to develop new opportunities, and overcome issues.
• New Machine installation and buyoff;
• Spare part inventory control;
• Conduct operation and maintenance training;
• Provides product, service, or equipment technical and engineering information by answering questions and requests.
• Establishes new accounts and services accounts by identifying potential customers; planning and organizing sales call schedule.
• Determines improvements by analyzing service applications in customer environment.
• Gains customers’ acceptance by explaining or demonstrating operations improvements. Contributes to team effort by accomplishing related results as needed

Requirements:

• Minimum Diploma in Mechanical/Electrical /Electronic/Mechatronic Engineer.
• Prefer with working experience in LED/Semiconductor Equipment.
• Familiar process of Probing, Wire Bonding, Handler, Curing.
• No experience candidates are welcome.
• Station at Batu Kawan, or Bayan Lepas.
• Possess own transport.
• Good communication skill (both spoken and written) in English and Mandarin (to liaise with Mandarin speaking associates).
• Required to visit & provide service support at customer site. Willing to travel to other countries.
• Preferably candidates who can start work within a month.
• Fresh graduates are encouraged to apply.