Service Engineer / Technical Support Engineer (advance packaging)

Key Responsibilities

• Technical Support: Act as the Tier-2 support expert for technical and quality issues, taking primary ownership of at least one machine platform.
• Issue & SLA Management: Efficiently manage, prioritize, and resolve service tickets using the JIRA service desk system in line with strict SLA targets.
• Cross-Functional Collaboration: Partner with Customer Service, R&D, Quality, and Product Line teams to analyze root causes, implement preventive actions, and resolve field issues.
• Knowledge Sharing: Guide FSEs through remote machine troubleshooting, participate in structured knowledge transfers, and stay updated on semiconductor industry trends.

Technical Skills & Qualifications

• Education: Bachelor’s or Master’s degree in Electronics, Electrical, or Mechatronics Engineering.
• Core Expertise: Background in the Die Attach process and application with hands-on knowledge of semiconductor equipment platforms.
• Project Management: Proven ability to handle multiple tasks, prioritize field issues efficiently, and collaborate with management to meet department KPIs.

Experience Profile

• Extensive experience specializing in semiconductor machine platforms, with a focus on hardware troubleshooting and application process optimization.
• Demonstrated track record in conducting root cause analysis and implementing preventive measures to enhance equipment performance.

Interested applicants for the above advertised position(s), please click on the APPLY button below

EA License No: 13C6305

Reg. No.: R1874608 | LEE JIA HOU

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