Shift Semiconductor Process Engineer

Our international client is currently searching for a Shift Semiconductor Process Engineer to provide hands-on, shift-based engineering support across semiconductor fabrication and backend manufacturing, ensuring safe, stable and efficient production. Working a rotating 12-hour shift pattern (2 days, 2 nights, 4 days off), the role focuses on process control, troubleshooting, yield improvement, production recovery and new product introduction (NPI).

Technology areas may include lithography and e-beam lithography, dry and wet etching, thin-film and metal deposition, and backend wafer processing.

Key Responsibilities

• Provide technical support to Manufacturing, troubleshooting process, product and equipment issues.
• Monitor process performance using SPC, MES and manufacturing data systems, responding to abnormal conditions.
• Investigate process excursions, identify root causes and implement containment, corrective and recovery actions.
• Improve yield, quality, process capability, throughput, cycle time and cost.
• Support process development, qualification, optimisation and NPI.
• Apply SPC, DOE, Six Sigma, Lean and statistical methods to drive continuous improvement.
• Escalate recurring or significant issues to relevant engineering teams and process owners.
• Mentor Manufacturing personnel and ensure compliance with process controls, quality standards and health, safety and environmental requirements.

Education, Skills & Experience

• Degree, postgraduate qualification or equivalent industrial experience in Semiconductor Technology, Materials Science, Physics, Chemistry, Engineering or a related discipline.
• Experience in semiconductor, MEMS, silicon photonics or other advanced manufacturing environments.
• Practical knowledge of one or more semiconductor processes, including lithography, etching, deposition, metallisation or backend wafer processing.
• Backend experience in wafer mounting, thinning, back grinding, CMP, polishing, cleaving or dicing is highly desirable.
• Understanding of SPC, DOE, Six Sigma, Lean Manufacturing and root-cause analysis.
• Strong analytical, troubleshooting and problem-solving skills, with the ability to interpret process and equipment data.
• Ability to work independently under pressure and collaborate effectively across multidisciplinary teams.
• Good written and verbal communication skills, including technical documentation and knowledge sharing.

Please contact Rachel Anderson for further details.