Silicon Photonics Characterization & Test Engineer

Singapore | R&D | Reporting to CTO

About ATI

ATI is a global optical connectivity company developing high-speed connectivity solutions for AI and hyperscale data centre infrastructure. Our portfolio spans high-speed optical transceivers, silicon photonics and advanced optical connectivity technologies supporting the industry's transition toward 800G, 1.6T and future generations of data centre interconnect.

With R&D capabilities across Wuhan Optics Valley, Silicon Valley and Singapore, and manufacturing operations in China and Thailand, ATI brings together photonics, electronics and high-volume manufacturing capabilities to serve leading global technology customers.

We are now building our next-generation R&D team in Singapore

, with a focus on silicon photonics and advanced optical interconnect technologies. This is an opportunity to join the team at an early stage and help shape ATI's technology platforms for the next generation of AI infrastructure.

About the Role

This role is responsible for the characterization, performance validation and failure analysis of ATI's silicon photonic chips following fabrication. You will develop and execute die-level test methodologies, analyze wafer and device performance, identify the root causes of performance deviations, and work closely with foundry and design teams to drive process and design improvements.

The role closes the feedback loop between

design, fabrication and test

, turning silicon data into actionable improvements for subsequent tape-outs and production readiness.

Core Responsibilities

1. Wafer Fabrication Tracking & Process Data Analysis

Track wafer fabrication progress with foundry partners and maintain visibility of key process milestones and technical issues.

Review and interpret

Wafer Acceptance Test (WAT)

and other relevant process-monitoring data.

Evaluate wafer process performance, variation and potential impact on silicon photonic device characteristics.

Identify abnormal process trends and coordinate technical investigation with foundry and internal engineering teams.

2. Die-Level Characterization & Test Development

Develop die-level characterization and test plans for silicon photonic chips following wafer fabrication.

Set up and execute optical and electrical measurements required to characterize key PIC devices and circuits.

Collect, analyze and report optoelectronic performance data across dies, wafers and process conditions.

Establish repeatable test methodologies and data-analysis processes to support design verification and engineering decisions.

3. Failure Analysis & Root-Cause Investigation

Investigate device and chip-level performance anomalies identified during characterization.

Correlate optical/electrical test results with WAT, layout, design and process data to localize potential failure mechanisms.

Work with foundry, PIC design and process engineers to conduct structured root-cause analysis.

Define and verify corrective actions through subsequent test, process changes or re-tape-out.

4. Process-Corner Evaluation & Optimization

Evaluate device performance across relevant

process corners and process variations

.

Use characterization results to identify design sensitivities, process limitations and yield risks.

Provide quantitative feedback to PIC design and foundry teams to improve device robustness and process windows.

Support design/process iteration from engineering samples through product qualification and production readiness.

What We Are Looking For

Education

Master's degree or above in Photonics, Optoelectronics, Electrical Engineering, Microelectronics, Applied Physics or a related discipline.

Technical Competencies

Strong understanding of silicon photonic device fundamentals and characterization techniques.

Hands-on experience with optical and/or electrical testing of silicon photonic devices or PICs.

Ability to interpret WAT and semiconductor process data.

Understanding of die-level characterization, statistical data analysis and failure-analysis methodologies.

Familiarity with semiconductor fabrication processes, process variation and process-corner concepts.

Experience with relevant optical/electrical laboratory equipment and automated test environments is advantageous.

Experience

Hands-on project or industry experience in silicon photonic chip characterization, wafer/die testing, failure analysis or foundry process engineering.

2+ years of relevant industry or research experience preferred.

Experience correlating silicon test results with device design and fabrication-process data is highly desirable.