苏州盛科通信股份有限公司
先进封装SIPI资深设计工程师
2 months ago
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Important information
Contract type:
Permanent
Location:
Shanghai, China
Work mode:
Onsite
Published on:
16 August 2026
What they need
该职位来源于猎聘 工作职责：
- 负责公司FCBGA和2.5D芯片产品的封装设计工作，完成封装的信号完整性仿真分析和电源仿真完整性分析 2. 负责封装和板级的联合信号完整性仿真分析和电源完整性仿真分析 3. 负责封装设计的最终交付和封装质量 4. 负责对接基板厂商和封装厂商的技术人员，沟通基板和封装的详细技术参数 5. 必要时参与基板或者板级的layout设计 任职资格： 1. 精通FCBGA封装和2.5D封装的高速信号完整性分析和电源完整性分析 2. 熟悉高速信号的在BT/ABF材质基板的布局布线规则和设计 3. 要求有先进封装(FCBGA, 2.5D)的成功流片经验
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