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Slicing process Engineering - Wafer

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Onsite

Slicing process Engineering - Wafer

Genxhire Services

Slicing process Engineering - Wafer

Skills

RData AnalysisProcess ImprovementCompliance

2 months ago

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Important information


Contract type:

Permanent

Location:

Jamnagar, Gujarat, India

Work mode:

Onsite

Published on:

27 August 2026

What they need


Role & responsibilities

Preferred candidate profile

Role & responsibilities:

  • Monitor and control Diamond Wire Slicing processes to ensure consistent production of silicon wafers meeting thickness, TTV, bow, warp, and surface quality specifications.

  • Analyze process performance data and identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.

  • Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.

  • Investigate and troubleshoot process abnormalities such as wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.

  • Collaborate with Production, Quality, Maintenance, and R&D teams to resolve process challenges and implement new technologies or process upgrades.

  • Monitor key process parameters including wire speed, feed rate, tension, coolant/slurry parameters, slicing time, and consumable usage to ensure process stability.

  • Conduct root cause analysis (RCA) and implement corrective and preventive actions (CAPA) for process deviations and quality issues.

  • Develop, update, and maintain process documentation, including SOPs, Work Instructions, Control Plans, Process Flow Diagrams, and troubleshooting guides.

  • Support process validation, qualification, and trial activities for new equipment, consumables, wire specifications, and process changes.

  • Participate in continuous improvement projects focused on wafer quality improvement, cycle time reduction, OEE improvement, and manufacturing cost reduction.

  • Monitor and improve process capability (Cp/Cpk) through Statistical Process Control (SPC) and data-driven process management.

  • Ensure compliance with safety, environmental, quality, and operational standards in all slicing activities.

  • Work closely with equipment engineers and maintenance teams to improve equipment reliability, uptime, and preventive maintenance effectiveness.

  • Support operator training and skill development by providing technical guidance and process-related coaching.

  • Prepare technical reports and present process performance metrics including yield, productivity, quality trends, consumable consumption, and improvement project results.

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