Slicing process Engineering - Wafer

Role & responsibilities

• Monitor and control Diamond Wire Slicing processes to ensure consistent production of silicon wafers meeting thickness, TTV, bow, warp, and surface quality specifications.
• Analyze process performance data and identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.
• Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.
• Investigate and troubleshoot process abnormalities such as wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.
• Collaborate with Production, Quality, Maintenance, and R&D teams to resolve process challenges and implement new technologies or process upgrades.