SMT Process Engineer

Job Summary

We are seeking a detail-oriented and data-driven SMT Process Engineer to join our automotive electronics manufacturing team. In this role, you will be responsible for developing, optimizing, and maintaining the Surface Mount Technology (SMT) assembly process. You will play a critical role in ensuring zero-defect manufacturing for safety-critical automotive components. The ideal candidate possesses deep technical expertise in Solder Paste Printing, Pick-and-Place, Reflow Profiling, and Automated Optical Inspection (AOI) , and preferably holds an IPC certification (e.g., IPC-A-610 CIS/CIT or J-STD-001) b

Key Responsibilities

Process Engineering & Optimization:

· Develop, validate, and continuously improve SMT processes including Solder Paste Printing, Component Pick-and-Place, Reflow Soldering, and Automated Optical Inspection (AOI) .

· Create and optimize reflow oven temperature profiles to ensure proper metallurgical bonding while preventing thermal damage to components, adhering to IPC/JEDEC standards.

· Program and fine-tune Pick-and-Place (PnP) machines to optimize cycle times, placement accuracy, and feeder setups.

· Develop and maintain AOI programs, including library creation, defect call-out logic, and false-call reduction strategies.

· Design and implement stencil designs, solder paste volume studies, and printing parameters to support fine-pitch and micro-BGA assemblies.

Automotive Quality & Standards:

· Ensure all processes comply with IATF 16949 and ISO 9001 quality management systems.

· Apply IPC standards (IPC-A-610, IPC J-STD-001, IPC-7351) to define acceptance criteria and operator training materials.

· Lead root cause analysis (8D, 5-Why, Fishbone) for SMT-related defects (e.g., tombstoning, bridging, insufficient solder, voids) and implement permanent corrective actions.

· Support PPAP, APQP, and PFMEA activities for new product introductions (NPI).

· Drive Zero Defect initiatives and continuous improvement (Kaizen) projects to reduce scrap, rework, and warranty returns.

New Product Introduction (NPI):

· Collaborate with Design for Manufacturing (DFM) teams to review PCB layouts and component selection for automotive harsh environments (thermal cycling, vibration).

· Conduct process validation builds (DOE) and prepare detailed engineering reports.

· Establish and document process parameters, work instructions, and control plans.

Equipment & Maintenance:

· Troubleshoot and resolve daily SMT line issues to minimize downtime.

· Coordinate with equipment vendors for maintenance, upgrades, and calibration.

· Maintain accurate calibration records for ovens, printers, and inspection systems.

Qualifications

Required:

· Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field.

· 3+ years of hands-on SMT process engineering experience in a manufacturing environment.

· Automotive industry experience is mandatory (understanding of IATF 16949, PPAP, APQP, and MSA).

· Preferably Active IPC Certification (e.g., IPC-A-610 CIS/CIT, IPC J-STD-001 CIS/CIT, or IPC-7711/7721).

· Expertise in Solder Paste Printing (stencil design, squeegee pressure, paste rheology).

· Expertise in Pick-and-Place programming and maintenance (e.g., Fuji, Panasonic, Yamaha, Juki, ASM).

· Expertise in Reflow Oven Profiling (thermocouple attachment, Soak/Spike profiles).

· Expertise in AOI programming and optimization (e.g., Koh Young, Omron, CyberOptics, Mirtec).

· Strong statistical analysis skills (SPC, DOE, Gage R&R).

Preferred:

· Experience with Selective Soldering, Wave Soldering, or Conformal Coating.

· Familiarity with MES (Manufacturing Execution Systems) and Industry 4.0 concepts.

· Lean Six Sigma Green Belt or Black Belt certification.

• · Experience with Underfill or Staking processes for automotive ruggedization.