Snr / Associate Equipment Engineer - Pre-assembly, Reconstitution

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

To identify equipment issues, drive yield/quality improvements, reduce costs, improve productivity, and assist team members.

Key responsibilities

Perform set-up and conversion to support production.

Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.

Determine methods and procedures independently and provide guidance to less experienced team members when required.

Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists.

Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.

What we're looking for

Diploma / ITC/NTC in Mechatronic, Mechanical Engineering, Physics, Electronics or equivalent

2 years of relevant experience in semiconductor are preferred.

Experience with Wafer Saw, Backgrind & Laser Groove equipment will be an advantage

Ability to work on 12 hours rotating shift

Join a leader in the industry!

STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.

Join us and expand your world.